MT46V128M8 MICRON [Micron Technology], MT46V128M8 Datasheet

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MT46V128M8

Manufacturer Part Number
MT46V128M8
Description
DOUBLE DATA RATE (DDR) SDRAM
Manufacturer
MICRON [Micron Technology]
Datasheet

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DOUBLE DATA RATE
(DDR) SDRAM
Features
• V
• Bidirectional data strobe (DQS) transmitted/
• Internal, pipelined double-data-rate (DDR)
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
• DLL to align DQ and DQS transitions with CK
• Four internal banks for concurrent operation
• Data mask (DM) for masking write data (x16 has two
• Programmable burst lengths: 2, 4, or 8
• Auto Refresh and Self Refresh Modes
• Longer lead TSOP for improved reliability (OCPL)
• 2.5V I/O (SSTL_2 compatible)
• Concurrent auto precharge option is supported
NOTE:
09005aef8076894f
1gbBDDRx4x8x16_1.fm - Rev. A 3/03 EN
OPTIONS
• Configuration
• Plastic Package – OCPL
• Timing – Cycle Time
• Temperature Rating
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY
received with data, i.e., source-synchronous data
capture (x16 has two – one per byte)
architecture; two data accesses per clock cycle
aligned with data for WRITEs
–one per byte)
t
256 Meg x 4 (64 Meg x 4 x 4 banks)
128 Meg x 8 (32 Meg x 8 x 4 banks)
64 Meg x 16 (16 Meg x 16 x 4 banks)
66-pin TSOP(400 mil width, 0.65mm
pin pitch)
66-pin TSOP Lead-Free (400 mil width,
0.65mm pin pitch)
7.5ns @ CL = 2.5 (DDR266B)
Commercial Temperature
(0 ° C to +70 ° C)
MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS.
RAS lockout supported (
DD
= +2.5V ±0.2V, V
1. Supports PC2100 modules with 2.5-3-3 timing
2. Supports PC1600 modules with 2-2-2 timing,
DD
Q = +2.5V ±0.2V
t
RAP =
1, 2
t
RCD)
MARKING
256M4
128M8
64M16
None
TG
-75
P
1
Key Timing Parameters
* Minimum clock rate @ CL= 2.5
** CL = CAS (Read) Latency
MT46V256M4 – 64 MEG X 4 X 4 BANKS
MT46V128M8 – 32 MEG X 8 X 4 BANKS
MT46V64M16 – 16 MEG X 16 X 4 BANKS
For the latest data sheet revisions, please refer to the
Micron Web site: www.micron.com/datasheets
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
GRADE
SPEED
Figure 1: Pin Assignment (Top View)
A10/AP
-75
V
V
V
CAS#
RAS#
V
V
DNU
WE#
DQ0
DQ1
BA0
BA1
DD
DD
DD
A13
V
V
CS#
V
SS
SS
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
x4
A0
A1
A2
A3
DD
DD
DD
Q
Q
Q
Q
Q
A10/AP
V
V
V
CAS#
RAS#
V
V
DQ0
DQ1
DQ2
DQ3
DNU
WE#
DD
DD
DD
A13
BA0
BA1
V
V
V
CS#
SS
SS
x8
NC
NC
NC
NC
NC
NC
NC
NC
A0
A1
A2
A3
DD
DD
DD
100 MHz
Q
Q
Q
Q
Q
CL=2**
A10/AP
V
V
V
LDQS
CAS#
RAS#
DQ0
DQ2
VssQ
DQ4
DQ5
DQ6
VssQ
DNU
LDM
CLOCKRATE
DQ1
DQ3
DQ7
WE#
DD
DD
DD
A13
BA0
BA1
V
V
V
CS#
x16
NC
NC
A0
A1
A2
A3
DD
DD
DD
Q
Q
Q
256 MEG X 4 128 MEG X 8 64 MEG X 16
64 Meg x 4 x 4
16K (A0–A13)
4(BA0,BA1)
4K(A0–A9,
A11, A12)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
CL=2.5**
66-pin TSOP
133MHz
banks
8K
1Gb: x4, x8, x16
WINDOW*
DATA-OUT
2K(A0–A9, A11)
32 Meg x 8 x 4
2.5ns
16K (A0–A13)
4(BA0,BA1)
DDR SDRAM
banks
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
8K
PRELIMINARY
x16
V
DQ15
V
DQ14
DQ13
V
DQ12
DQ11
V
DQ10
DQ9
V
DQ8
NC
V
UDQS
DNU
V
V
UDM
CK#
CK
CKE
NC
A12
A11
A9
A8
A7
A6
A5
A4
V
WINDOW
ACCESS
±0.75ns
SS
SS
DD
SS
DD
SS
REF
SS
SS
©2003 Micron Technology, Inc.
Q
Q
Q
Q
Q
16 Meg x 16 x 4
16K (A0–A13)
V
DQ7
V
NC
DQ6
V
NC
DQ5
V
NC
DQ4
V
NC
NC
V
DQS
DNU
V
V
DM
CK#
CK
CKE
NC
A12
A11
A9
A8
A7
A6
A5
A4
V
x8
4(BA0,BA1)
SS
SS
DD
SS
DD
SS
REF
SS
SS
1K(A0–A9)
Q
Q
Q
Q
Q
banks
8K
DQS–DQ
+0.5ns
SKEW
V
NC
V
NC
DQ3
V
NC
NC
V
NC
DQ2
V
NC
NC
V
DQS
DNU
V
V
DM
CK#
CK
CKE
NC
A12
A11
A9
A8
A7
A6
A5
A4
V
x4
SS
SS
DD
SS
DD
SS
REF
SS
SS
Q
Q
Q
Q
Q

Related parts for MT46V128M8

MT46V128M8 Summary of contents

Page 1

... MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S PRODUCTION DATA SHEET SPECIFICATIONS. MT46V256M4 – 64 MEG BANKS MT46V128M8 – 32 MEG BANKS MT46V64M16 – 16 MEG BANKS For the latest data sheet revisions, please refer to the Micron Web site: www ...

Page 2

DDR SDRAM Part Numbers Example Part Number: MT46V64M16TG-75 - MT46V Configuration Package Speed Configuration 256 Meg x4 256M4 128 Meg x8 128M8 64 Meg x16 64M16 Package 400 mil TSOP TG 400 mil TSOP Lead-Free P -75 General Description ...

Page 3

TABLE OF CONTENTS Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

List of Figures Figure 1: Pin Assignment (Top View) 66-pin TSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

List of Tables Table 1: Ball/Pin Descriptions ...

Page 6

Figure 2: Functional Block Diagram 256 Meg x4 CKE CK# CK CONTROL CS# LOGIC WE# CAS# RAS# REFRESH 14 MODE REGISTERS COUNTER 16 14 A0-A13, ADDRESS 16 BA0, BA1 REGISTER 2 12 09005aef8076894f 1gbDDRx4x8x16_2.fm - Rev. A 3/03 EN BANK3 ...

Page 7

Figure 3: Functional Block Diagram 128 Meg x8 CKE CK# CK CONTROL CS# LOGIC WE# CAS# RAS# REFRESH 14 MODE REGISTERS COUNTER 16 14 A0-A13, ADDRESS 16 BA0, BA1 REGISTER 2 11 09005aef8076894f 1gbDDRx4x8x16_2.fm - Rev. A 3/03 EN BANK3 ...

Page 8

Figure 4: Functional Block Diagram 64 Meg x16 CKE CK# CK CONTROL CS# LOGIC WE# CAS# RAS# REFRESH 14 COUNTER MODE REGISTERS 16 14 A0-A13, ADDRESS 16 BA0, BA1 REGISTER 2 10 09005aef8076894f 1gbDDRx4x8x16_2.fm - Rev. A 3/03 EN BANK3 ...

Page 9

Table 1: Ball/Pin Descriptions TSOP NUMBERS SYMBOL 45, 46 CK, CK# 44 CKE 24 CS# 23, 22, RAS#, CAS 20, 47 LDM, UDM 26, 27 BA0, BA1 29, 30, 31, 32, A0, A1, A2, A3, 35, ...

Page 10

Table 1: Ball/Pin Descriptions (Continued) TSOP NUMBERS SYMBOL DQ0–DQ2 11, 56, 59, DQ3–DQ5 62, 65 DQ6, DQ7 5, 11, 56, DQ0–DQ2 62 DQ3 51 DQS 16 LDQS 51 UDQS 14, 25, NC 43, 53 19, 50 DNU ...

Page 11

Functional Description The 1Gb DDR SDRAM is a high-speed CMOS, dynamic random-access memory 1,073,741,824 bits. The 1Gb DDR SDRAM is internally configured as a quad-bank DRAM. The 1Gb DDR SDRAM uses a double data rate archi- tecture to achieve high-speed ...

Page 12

Burst Length Read and write accesses to the DDR SDRAM are burst oriented, with the burst length being program- mable, as shown in Figure 5. The burst length deter- mines the maximum number of column locations that can be accessed ...

Page 13

Table 2: Burst Definition ORDER OF ACCESSES WITHIN A STARTING BURST COLUMN TYPE= LENGTH ADDRESS SEQUENTIAL 0 0-1-2 1-2-3 2-3-0 3-0-1 ...

Page 14

Extended Mode Register The extended mode register controls functions beyond those controlled by the mode register; these additional functions are DLL enable/disable, and out- put drive strength. These functions are controlled via the bits shown in Figure 7. The extended ...

Page 15

Commands Table 4 and Table 5 provide a quick reference of available commands. This is followed by a verbal description of each command. Two additional Truth Table 4: Truth Table – Commands Note 1 applies to all commands NAME (FUNCTION) ...

Page 16

DESELECT The DESELECT function (CS# HIGH) prevents new commands from being executed by the DDR SDRAM. The DDR SDRAM is effectively deselected. Operations already in progress are not affected. NO OPERATION (NOP) The NO OPERATION (NOP) command is used to ...

Page 17

Operation section of this data sheet. The user must not issue another command to the same bank until the precharge time ( completed. BURST TERMINATE The BURST TERMINATE command is used to trun- cate ...

Page 18

Operations Bank/Row Activation Before any READ or WRITE commands can be issued to a bank within the DDR SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE command, which selects both the bank and ...

Page 19

READs READ bursts are initiated with a READ command, as shown in Figure 10 on page 20. The starting column and bank addresses are pro- vided with the READ command and auto precharge is either enabled or disabled for that ...

Page 20

Rev. A 3/03 EN Figure 10: READ Command CK# CK CKE HIGH CS# RAS# CAS# WE# x4: A0–A9, A11, A12 CA x8: A0–A9, A11 x16: A0–A9 x4: A13 x8: A12, A13 x16: A11, A12, A13 EN AP ...

Page 21

T0 CK# CK COMMAND READ Bank a, ADDRESS Col n DQS DQ T0 CK# CK COMMAND READ Bank a, ADDRESS Col n DQS DQ NOTE data-out from column n. 2. Burst length = 4. 3. Three ...

Page 22

T0 CK# CK COMMAND READ Bank, ADDRESS Col n DQS DQ T0 CK# CK COMMAND COMMAND READ Bank, ADDRESS ADDRESS Col n DQS DQ NOTE ( data-out from column n (or column b). 2. Burst ...

Page 23

Figure 13: Nonconsecutive READ Bursts T0 CK# CK COMMAND READ Bank, ADDRESS Col n DQS DQ T0 CK# CK COMMAND COMMAND READ Bank, ADDRESS ADDRESS Col n DQS DQ NOTE ( data-out from column n ...

Page 24

T0 CK# CK COMMAND READ Bank, ADDRESS Col n DQS DQ T0 CK# CK COMMAND COMMAND READ Bank, ADDRESS ADDRESS Col n DQS DQ NOTE ( data-out from column n (or ...

Page 25

Figure 15: Terminating a READ Burst T0 CK# CK COMMAND READ Bank a, ADDRESS Col n DQS DQ T0 CK# CK COMMAND READ Bank a, ADDRESS Col n DQS DQ NOTE data-out from column n. 2. ...

Page 26

T0 CK# CK COMMAND READ Bank, ADDRESS Col n DQS CK# CK COMMAND READ Bank a, ADDRESS Col n DQS DQ DM NOTE data-out from column data-in from ...

Page 27

T0 CK COMMAND READ Bank a, ADDRESS Col n DQS COMMAND READ Bank a, ADDRESS Col n DQS DQ NOTE data-out from column n. 2. Burst length = 4, ...

Page 28

WRITEs WRITE bursts are initiated with a WRITE command, as shown in Figure 18. The starting column and bank addresses are pro- vided with the WRITE command, and auto precharge is either enabled or disabled for that access. If auto ...

Page 29

CK# CK COMMAND ADDRESS t DQSS (NOM) DQS DQSS (MIN) DQS DQSS (MAX) DQS DQ DM NOTE data-in for column b. 2. Three subsequent elements of data-in are applied in ...

Page 30

Figure 20: Consecutive WRITE to WRITE T0 CK# CK COMMAND WRITE Bank, ADDRESS Col DQSS (NOM) DQSS DQS DQ DM NOTE etc. = data-in for column b, etc. 2. Three subsequent elements of data-in ...

Page 31

Figure 21: Nonconsecutive WRITE to WRITE T0 CK# CK COMMAND WRITE Bank, ADDRESS Col DQSS (NOM) DQSS DQS DQ DM NOTE etc. = data-in for column b, etc. 2. Three subsequent elements of data-in ...

Page 32

T0 CK# CK COMMAND WRITE Bank, ADDRESS Col b t DQSS (NOM) DQS DQ DM NOTE etc. = data-in for column b, etc. 2. b', etc. = the next data-in following DI b, etc., according to the ...

Page 33

Figure 23: WRITE to READ - Uninterrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS (MAX) DQSS DQS ...

Page 34

Figure 24: WRITE to READ - Interrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS (MAX) DQSS ...

Page 35

Figure 25: WRITE to READ - Odd Number of Data, Interrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS ...

Page 36

Figure 26: WRITE to PRECHARGE - Uninterrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS (MAX) DQSS ...

Page 37

Figure 27: WRITE to Precharge – Interrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS (MAX) DQSS ...

Page 38

Figure 28: WRITE to PRECHARGE Odd Number of Data, Interrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS ...

Page 39

PRECHARGE The PRECHARGE command as shown in Figure 29, is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be avail- able for a subsequent row access some specified ...

Page 40

T0 CK# CK CKE COMMAND VALID No READ/WRITE access in progress Table 6: Truth Table – CKE Notes: 1-6 CKE CKE CURRENT STATE n Power-Down Self Refresh L H Power-Down Self Refresh H L All Banks Idle ...

Page 41

Table 7: Truth Table – Current State Bank n - Command to Bank n (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS# CAS# Any Idle ...

Page 42

Write w/Auto- Precharge Enabled: Starts with registration of a WRITE command with auto precharge enabled and ends when has been met. Once RP is met, the bank will be in the idle state. 5. The following states ...

Page 43

Table 8: Truth Table – Current State Bank n - Command to Bank m (Notes: 1-6; notes appear below and on next page) CURRENT STATE CS# RAS# Any Idle Row L L Activating, L ...

Page 44

This device supports concurrent auto precharge such that when a read with auto pre- charge is enabled or a write with auto precharge is enabled any command to other banks is allowed, as long as that command does not interrupt ...

Page 45

Absolute Maximum Ratings Stresses greater than those listed may cause perma- nent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the opera- ...

Page 46

Transmitter 09005aef8076894f 1gbDDRx4x8x16_2.fm - Rev. A 3/03 EN Figure 31: Input Voltage Waveform V Q (2.3V minimum (1.670V for SSTL2 termination) OH(MIN) System Noise Margin (Power/Ground, Crosstalk, Signal Integrity Attenuation) 1.560V 1.400V 1.300V 1.275V 1.250V 1.225V 1.200V ...

Page 47

Table 11: Clock Input Operating Conditions 0°C £ T £ +70° +2.5V ±0.2V Notes: 1–5, 15, 16, 30; notes appear on page 54-57 PARAMETER/CONDITION Clock Input Mid-Point Voltage; CK and CK# Clock Input Voltage ...

Page 48

Table 12: Capacitance (x4, x8) (Note: 13; notes appear on page 54-57) PARAMETER Delta Input/Output Capacitance: DQ0-DQ3 (x4), DQ0-DQ7 (x8) Delta Input Capacitance: Command and Address Delta Input Capacitance: CK, CK# Input/Output Capacitance: DQs, DQS, DM Input Capacitance: Command and ...

Page 49

Table 14: I Specifications and Conditions (x4, x8) DD 0°C £ T £ +70° +2.5V ±0.2V Notes: 1–5, 10, 12, 14; notes appear on page 54-57; See also Table 16, I PARAMETER/CONDITION OPERATING CURRENT: ...

Page 50

Table 15: I Specifications and Conditions (x16) DD 0°C £ T £ +70° +2.5V ±0.2V Notes: 1–5, 10, 12, 14; notes appear on page 54-57; See also Table 16, I PARAMETER/CONDITION OPERATING CURRENT: One ...

Page 51

Table 16: I Test Cycle Times DD Values reflect number of clock cycles for each test. SPEED CLOCK IDD TEST GRADE CYCLE TIME I 0 -75 7.5ns -75 7.5ns -75 7.5ns ...

Page 52

Table 17: Electrical Characteristics and Recommended AC Operating Conditions 0°C £ T £ +70° +2.5V ±0.2V Notes: 1–5, 14–17, 33, notes appear on page 54-57 AC CHARACTERISTICS PARAMETER Access window of DQs from CK/CK# ...

Page 53

Table 18: Input Slew Rate Derating Values for Addresses and Commands 0°C £ T £ +70° +2.5V ±0.2V Notes: 14; notes appear on page 54-57 SPEED SLEW RATE -75 0.500V / ns -75 0.400V ...

Page 54

Notes 1. All voltages referenced Tests for AC timing and electrical AC and DC DD characteristics may be conducted at nominal ref- erence/supply voltage levels, but the related spec- ifications and device operation are ...

Page 55

RAS (MAX) for I measurements is the DD t largest multiple of CK that meets the maxi- t mum absolute value for RAS. 23. The refresh period is 64ms. This equates ...

Page 56

The clock is allowed up to ±150ps of jitter. Each timing parameter is allowed to vary by the same amount 34. HP (MIN) is the lesser of CL minimum and minimum actually applied to the device CK ...

Page 57

The full variation in the ratio of the maximum to minimum pull-up and pull-down current should be between 0.71 and 1.4 for device drain-to-source voltages from 0.1V to 1.0V, and at the same voltage and temperature. f. The full ...

Page 58

Table 20: Normal Output Drive Characteristics PULL-DOWN CURRENT (mA) VOLTAGE NOMINAL NOMINAL (V) LOW HIGH 0.1 6.0 6.8 0.2 12.2 13.5 0.3 18.1 20.1 0.4 24.1 26.6 0.5 29.8 33.0 0.6 34.6 39.1 0.7 39.4 44.2 0.8 43.7 49.8 0.9 ...

Page 59

Table 21: Reduced Output Drive Characteristics PULL-DOWN CURRENT (mA) VOLTAGE NOMINAL NOMINAL (V) LOW HIGH 0.1 3.4 3.8 0.2 6.9 7.6 0.3 10.3 11.4 0.4 13.6 15.1 0.5 16.9 18.7 0.6 19.9 22.1 0.7 22.3 25.0 0.8 24.7 28.2 0.9 ...

Page 60

Figure 38: x4, x8 Data Output Timing – CK DQS DQ (Last data valid (First data no longer valid) DQ (Last data valid) DQ (First ...

Page 61

Figure 39: x16 Data Output Timing – CK LDQS DQ (Last data valid (First data no longer valid) DQ (Last data valid) DQ (First data no longer valid) DQ0 - DQ7 ...

Page 62

Figure 40: Data Output Timing – CK (MIN) 2 DQS, or LDQS/UDQS DQ (Last data valid) DQ (First data valid) 3 All DQ values, collectively NOTE DQSCK is the DQS output window relative ...

Page 63

Figure 42: Initialize And Load Mode Registers ( ( ) ) VTD ( ( ) REF ) ) CK ...

Page 64

T0 CK CKE VALID 1 COMMAND ADDR VALID DQS DQ DM NOTE this command is a PRECHARGE (or if the device is already in the ...

Page 65

CKE NOP 2 COMMAND PRE A0-A9, A11 1 A12, A13 ALL BANKS 1 A10 ONE BANK Bank(s) 4 BA0, BA1 5 ...

Page 66

CKE COMMAND NOP AR ADDR DQS Enter Self Refresh Mode NOTE: 1. Clock must ...

Page 67

Figure 46: Bank Read - Without Auto Precharge CKE NOP 6 COMMAND ACT t IS x4: A0-A9, A11, A12 x8: A0-A9, A11 RA x16: A0-A9 x4: A13 ...

Page 68

Figure 47: Bank Read - With Auto Precharge CKE NOP 5 COMMAND ACT t IS x4: A0-A9, A11, A12 x8: A0-A9, A11 RA x16: A0-A9 x4: A13 ...

Page 69

Figure 48: Bank Write - Without Auto Precharge CKE NOP 6 COMMAND ACT t IS x4: A0-A9, A11, A12 x8: A0-A9, A11 RA x16: A0-A9 x4: A13 ...

Page 70

Figure 49: Bank Write - With Auto Precharge CKE NOP 5 COMMAND ACT t IS x4: A0-A9, A11, A12 x8: A0-A9, A11 RA x16: A0-A9 x4: A13 ...

Page 71

CKE NOP 6 COMMAND ACT t IS x4: A0-A9, A11, A12 x8: A0-A9, A11 RA x16: A0-A9 x4: A13 x8: A21, A13 RA x16: A11, A12, A13 ...

Page 72

Figure 51: 66-Pin Plastic TSOP (400 mil) 22.22 ± 0.08 0.65 TYP 0.32 ± .075 TYP PIN #1 ID NOTE: 1. All dimensions in millimeters 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm ...

Page 73

Rev. A 3/03 EN 1Gb: x4, x8, x16 Micron Technology, Inc., reserves the right to change products or specifications without notice. 73 PRELIMINARY DDR SDRAM ©2003 Micron Technology. Inc. ...

Page 74

S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992 Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc. All other trademarks ...

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