nlx3g16 ON Semiconductor, nlx3g16 Datasheet
nlx3g16
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nlx3g16 Summary of contents
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... NLX3G16 Triple Non-Inverting Buffer The NLX3G16 MiniGatet is an advanced high−speed CMOS triple non−inverting buffer in ultra−small footprint. The NLX3G16 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. Features • High Speed 1.8 ns (Typ • ...
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MAXIMUM RATINGS Symbol V DC Supply Voltage Input Voltage Output Voltage OUT I DC Input Diode Current Output Diode Current Output Source/Sink Current Supply Current ...
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DC ELECTRICAL CHARACTERISTICS Symbol Parameter Conditions V Low−Level IH Input Voltage V Low−Level IL Input Voltage V High− Level I = −100 mA OH Output Voltage ...
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AC ELECTRICAL CHARACTERISTICS V CC (V) Symbol Parameter t , Propagation 1.65−1.95 PLH t Delay Input A to PHL Output 2.3−2.7 3.0−3.6 4.5−5.5 C Input 5.5 IN Capacitance C Power 3.3 PD Dissipation 5.5 Capacitance (Note ...
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... ORDERING INFORMATION Device NLX3G16AMX1TCG NLX3G16BMX1TCG NLX3G16CMX1TCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package ULLGA8, 1.95 x 1.0, 0.5P (Pb−Free) ULLGA8, 1.6 x 1.0, 0.4P (Pb−Free) ULLGA8, 1.45 x 1.0, 0.35P (Pb−Free) http://onsemi.com 5 † ...
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... *For additional information on our Pb−Free strategy and soldering NOTE 3 0.05 C details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0 ...
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... *For additional information on our Pb−Free strategy and soldering 0.05 C NOTE 3 details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND ...
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... PACKAGE IS ALLOWED. MILLIMETERS DIM MIN MAX A −−− 0.40 A1 0.00 0.05 b 0.15 0.25 D 1.95 BSC E 1.00 BSC e 0.50 BSC L 0.25 0.35 L1 0.30 0.40 MOUNTING FOOTPRINT SOLDERMASK DEFINED 0.49 0.30 1.24 1 0.50 PKG PITCH OUTLINE DIMENSIONS: MILLIMETERS ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NLX3G16/D ...