UCLAMP3304A.TCT Semtech, UCLAMP3304A.TCT Datasheet - Page 4
![IC TVS ARRAY 4-LINE 3.3V SC89-6](/photos/10/64/106427/uclamp3304a_tct_sml.jpg)
UCLAMP3304A.TCT
Manufacturer Part Number
UCLAMP3304A.TCT
Description
IC TVS ARRAY 4-LINE 3.3V SC89-6
Manufacturer
Semtech
Series
µClamp™r
Datasheet
1.UCLAMP3304A.TCT.pdf
(8 pages)
Specifications of UCLAMP3304A.TCT
Voltage - Reverse Standoff (typ)
3.3V
Voltage - Breakdown
3.5V
Power (watts)
40W
Polarization
4 Channel Array - Unidirectional
Mounting Type
Surface Mount
Package / Case
SC-89-6, SOT-563F, SOT-666
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
UCLAMP3304ATR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UCLAMP3304A.TCT
Manufacturer:
AD
Quantity:
1 043
Part Number:
UCLAMP3304A.TCT
Manufacturer:
SEMTECH/美国升特
Quantity:
20 000
Device Connection for Protection of Four Data Lines
These devices are designed to protect up to four
unidirectional data lines. The device is connected as
follows:
1. Unidirectional protection of four I/O lines is
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
PROTECTION PRODUCTS
Applications Information
2005 Semtech Corp.
achieved by connecting pins 1, 3, 4, and 6 to the
data lines. Pins 2 and 5 are connected to ground.
The ground connection should be made directly to
the ground plane for best results. The path length
is kept as short as possible to reduce the effects
of parasitic inductance in the board traces.
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
4
Protection of Four Unidirectional Lines
1
Circuit Diagram
3
2, 5
µClamp3304A
4
www.semtech.com
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