MMBZ5V6ALT1G ON Semiconductor, MMBZ5V6ALT1G Datasheet - Page 4

• Manufacturer Part Number: MMBZ5V6ALT1G
• Description: TVS ZENER DUAL 24W CA 5.6V SOT23
• Manufacturer: ON Semiconductor
• Type: Zenerr

Specifications of MMBZ5V6ALT1G

• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 5.32V
• Power (watts): 24W
• Polarization: 2 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Polarity: Unidirectional
• Channels: 2 Channels
• Clamping Voltage: 8 V
• Operating Voltage: 3 V
• Breakdown Voltage: 5.32 V
• Termination Style: SMD/SMT
• Peak Surge Current: 3 A
• Peak Pulse Power Dissipation: 24 W
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Dimensions: 1.3 mm W x 2.9 mm L
• Brand/series: MMBZ5V6ALT1 Series
• Current, Surge: 3 A
• Primary Type: Transient Voltage Surge Suppressor
• Termination: Solder
• Voltage, Clamping: 8 V
• Number Of Elements: 2
• Package Type: SOT-23
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 5.32V
• Reverse Stand-off Voltage: 3V
• Leakage Current (max): 5uA
• Peak Pulse Current: 3A
• Test Current (it): 20mA
• Operating Temp Range: -55C to 150C
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: Data/Comm, Industrial Equipment
• Other names: MMBZ5V6ALT1GOS; MMBZ5V6ALT1GOS; MMBZ5V6ALT1GOSTR

A
A1
E
1
3
D
e
2
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
MMBZ5V6ALT1 Series
PACKAGE DIMENSIONS
0.8
SOLDERING FOOTPRINT
VIEW C
L1
SOT−23 (TO−236)
L
CASE 318−08
ISSUE AN
q
0.25
7
c
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
0.079
STYLE 12:
2.0
PIN 1. CATHODE
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
DIM
inches
A1
H
L1
A
b
D
E
c
e
L
mm
E
2. CATHODE
3. ANODE
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
1.11
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
MMBZ5V6ALT1/D
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX