SACB50 Littelfuse Inc, SACB50 Datasheet - Page 3

DIODE TVS 50V 500W UNI SMD

SACB50

Manufacturer Part Number
SACB50
Description
DIODE TVS 50V 500W UNI SMD
Manufacturer
Littelfuse Inc
Series
SACBr
Datasheet

Specifications of SACB50

Voltage - Reverse Standoff (typ)
50V
Voltage - Breakdown
55.5V
Power (watts)
500W
Polarization
Unidirectional
Mounting Type
Surface Mount
Package / Case
DO-214AA, SMB
Reverse Stand-off Voltage Vrwm
50V
Breakdown Voltage Range
7.6V
Clamping Voltage Vc Max
88V
Diode Configuration
Unidirectional
Peak Pulse Current Ippm
5.8A
Diode Case Style
DO-214AA
No. Of Pins
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SACB50
Manufacturer:
VISHAY/威世
Quantity:
20 000
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.Littelfuse.com/series/SACB.html for current information.
Soldering Parameters
Physical Specifications
Dimensions
Reflow Condition
Pre Heat
Average ramp up rate (Liquidus Temp
(T
T
Reflow
Peak Temperature (T
Time within 5°C of actual peak
Temperature (t
Ramp-down Rate
Time 25°C to peak Temperature (T
Do not exceed
Weight
Case
Polarity
Terminal
S(max)
L
) to peak
to T
A
D
L
E
- Ramp-up Rate
- Temperature Min (T
- Temperature Max (T
- Time (min to max) (t
- Temperature (T
- Time (min to max) (t
DO-214AA (SMB J-Bend)
p
)
P
)
0.003oz., 0.093g
JEDEC DO-214AA molded plastic body
over glass passivated junction.
Color band denotes cathode except
Bidirectional
Matte Tin-plated leads. Solderable per
JESD22-B102D.
Cathode Band
B
G
F
L
) (Liquidus)
s(min)
s(max)
s
s
)
)
P
)
)
)
H
C
150°C
200°C
3°C/second max
3°C/second max
217°C
260
6°C/second max
8 minutes Max.
280°C
Transient Voltage Suppression Diodes
Surface Mount – 500W > SACB series
+0/-5
°C
Revision: January 09, 2009
21
Peak Temperature :
Dipping Time :
Soldering :
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
Thermal Shock
Flow/Wave Soldering (Solder Dipping)
Environmental Specifications
Dimensions
T
T
s(max)
s(min)
25˚C
T
T
P
L
A
B
C
D
E
G
H
F
0.077
0.084
0.030
0.205
0.006
0.160
0.130
Min
-
Preheat
t 25˚C to Peak
t
s
Inches
0.086
0.096
0.060
0.008
0.220
0.180
0.155
0.012
Max
Time (t)
265
10 seconds
1 time
JESD22-A104
JESD 22-A102
JESD22-A103
JESD22-A108
JESD22-A106
Ramp-up
O
C
4.060
3.300
2.130
t
1.950
0.760
5.210
0.152
p
Min
-
Millimeters
t
L
Ramp-down
SACB Series
2.200
4.570
3.940
2.440
1.520
0.203
5.590
0.305
Critical Zone
Max
T
L
to T
P

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