SPLV2.8-4BTG Littelfuse Inc, SPLV2.8-4BTG Datasheet - Page 3

TVS DIODE ARRAY 4CH 3.8PF SOIC-8

SPLV2.8-4BTG

Manufacturer Part Number
SPLV2.8-4BTG
Description
TVS DIODE ARRAY 4CH 3.8PF SOIC-8
Manufacturer
Littelfuse Inc
Series
SPA™ SPLVr
Datasheet

Specifications of SPLV2.8-4BTG

Package / Case
8-SOIC (3.9mm Width)
Voltage - Reverse Standoff (typ)
2.8V
Voltage - Breakdown
3V
Power (watts)
400W
Polarization
4 Channel Array - Bidirectional
Mounting Type
Surface Mount
Clamping Voltage
6.8 V, 12.5 V
Current Rating
24 A
Operating Voltage
2.8 V
Channels
4 Channels
Breakdown Voltage
3 V
Capacitance
5 pF
Termination Style
SMD/SMT
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
F3529TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SPLV2.8-4BTG
Manufacturer:
LITTELFUSE/力特
Quantity:
20 000
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to
TVS Diode Arrays
Lightning Surge Protection - SPLV2.8-4 Series
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-203 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Product Characteristics
Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline
Lead Plating
Lead Material
Lead Coplanarity
Subsitute Material
Body Material
Flammability
L
o
F
www.littelfuse.com/SPA
for current information.
Matte Tin
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL94-V-0
(SPA
Soldering Pad Outline
Family of Products)
(Reference Only)
Recommended
Revision: April 14, 2011
127
Soldering Parameters
Reflow Condition
Pre Heat
Average ramp up rate (Liquidus) Temp
(T
T
Reflow
Peak Temperature (T
Time within 5°C of actual peak
Temperature (t
Ramp-down Rate
Time 25°C to peak Temperature (T
Do not exceed
Package
S(max)
JEDEC
L
Pins
) to peak
A1
A2
E1
A
D
B
E
e
L
c
T
T
S(max)
to T
S(min)
25
T
T
P
L
L
- Ramp-up Rate
- Temperature Min (T
- Temperature Max (T
- Time (min to max) (t
- Temperature (T
- Temperature (t
p
time to peak temperature
)
0.31
4.80
5.80
3.80
0.40
Min
1.35
0.10
1.25
0.17
Millimetres
1.27 BSC
P
)
t
S
Preheat
Preheat
L
L
)
) (Liquidus)
6.20
Max
5.00
4.00
1.27
1.75
0.25
1.65
0.51
0.25
Ramp-up
Ramp-up
MO-223 Issue A
MS-012 (SO-8)
s(min)
s(max)
s
)
P
)
)
)
8
0.004
0.007
0.053
0.050
0.012
0.189
0.228
0.150
0.016
Min
Pb – Free assembly
150°C
200°C
60 – 180 secs
5°C/second max
5°C/second max
217°C
60 – 150 seconds
250
20 – 40 seconds
5°C/second max
8 minutes Max.
260°C
t
t
P
L
0.050 BSC
+0/-5
Inches
Ramp-down
Ramp-do
Time
°C
SPLV2.8-4 Series
Critical Zone
Critical Zone
T
T
L
L
to T
to T
0.244
0.050
0.069
0.065
0.020
0.197
0.157
0.010
0.010
Max
P
P

Related parts for SPLV2.8-4BTG