T494A475K010AT Kemet, T494A475K010AT Datasheet - Page 15

• Manufacturer Part Number: T494A475K010AT
• Description: CAP TANT 4.7UF 10V 10% SMD
• Manufacturer: Kemet
• Series: T494r
• Type: Moldedr

Specifications of T494A475K010AT

• Capacitance: 4.7µF
• Voltage - Rated: 10V
• Tolerance: ±10%
• Esr (equivalent Series Resistance): 3.000 Ohm
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 1206 (3216 Metric)
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Height: 0.063" (1.60mm)
• Manufacturer Size Code: A
• Features: General Purpose
• Voltage Rating: 10 Volts
• Esr: 3 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Mfr Case Code: A Case
• Dimensions: 1.6 mm W x 3.2 mm L x 1.6 mm H
• Lead Spacing: 0.8 mm
• Leakage Current: 0.5 uAmps
• Product: Tantalum Solid Low ESR Industrial Grade
• Termination Style: SMD/SMT
• Tolerance (+ Or -): 10%
• Voltage: 10VDC
• Mounting Style: Surface Mount
• Polarity: Polar
• Construction: SMT Chip
• Case Style: Molded
• Case Code: A
• Lead Spacing (nom): Not Requiredmm
• Df: 6%
• Dcl: 0.5uA
• Seal: Not Required
• Insulation: Not Required
• Failure Rate: Not Required
• Wire Form: Not Required
• Product Length (mm): 3.2mm
• Product Height (mm): 1.6mm
• Product Depth (mm): 1.6mm
• Product Diameter (mm): Not Requiredmm
• Seated Plane Height: Not Requiredmm
• Length W/weld (max): Not Requiredmm
• Operating Temp Range: -55C to 125C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Low ESR MnO
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase reflow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for convection and IR reflow reflect
the profile conditions of the IPC/J-STD-020D standard for moisture
sensitivety testing. The devices can safely withstand a maximum of
three reflow passes at these conditions.
Note that although the X/7343-43 case size can withstand wave
soldering, the tall profile (4.3mm maximum) dictates care in wave
process development.
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
Time 25°C to peak temperature
Silver Paint
Time within 5°C of max peak
Liquidous temperature (T
Time (t
Ramp-down rate (T
Time above liquidous (t
Temperature Max (T
Profile Feature
Temperature Min (T
Ramp-up rate (T
Peak Temperature (T
Leadframe
(-Cathode)
temperature (t
Preheat/Soak
s
) from T
2
smin
Tantalum Surface Mount Capacitors – T494 Industrial Grade Low ESR MnO
MNO
L
to T
to T
P
P
)
to T
Smin
Smax
smax
P
P
L
)
)
)
)
)
L
L
)
)
)
2
Carbon
/Ta
2
Sn-Pb Assembly
O
5
/Ta
6 minutes max
3°C/sec max
6°C/sec max
Tantalum Wire
20 sec max
60-120 sec
60-150 sec
235°C**
220°C*
100°C
150°C
183°C
Pb-Free Assembly
Silver Adhesive
Weld
8 minutes max
3°C/sec max
6°C/sec max
30 sec max
60-120 sec
60-150 sec
260°C**
250°C*
150°C
200°C
217°C
Washer
Leadframe
(+Anode)
T
T
25
smax
smin
T
T
2
P
L
Series
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
Time/Temperature Soldering Profile
25° C to Peak
t
S
Time
T2008-1 • 1/17/2011
t
L
t
P
15 15