MFU0603FF04000P100 Vishay, MFU0603FF04000P100 Datasheet - Page 11

• Manufacturer Part Number: MFU0603FF04000P100
• Description: FUSE 4.00A 0603 VFAST SMD
• Manufacturer: Vishay
• Series: MFUr

Specifications of MFU0603FF04000P100

• Fuse Type: Fast Acting
• Voltage - Rated: 32VDC
• Current: 4A
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.031" W x 0.018" H (1.60mm x 0.80mm x 0.45mm)
• Mounting Type: Surface Mount
• Dc Cold Resistance: 0.019 Ohm
• Melting I²t: 0.0403
• Voltage Rating Vdc: 32V
• Fuse Current: 4A
• Breaking Capacity: 50A @ 32VDC
• Blow Characteristic: Very Fast Acting
• Fuse Case Style: 0603
• Fuse Terminals: SMD Caps
• Current Rating: 4A
• External Depth: 1.55mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Color: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: MFU06034.00TR

TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
IEC 60127-1, Miniature fuse - Part 1: Definitions for miniature
fuses and general requirements for miniature fuse-links
IEC 60127-4, Universal Modular Fuse Links (UMF)
UL 248-1, Low voltage fuses - Part 1: General requirements
UL 248-14, Low voltage fuses - Part 14: Supplemental fuses
For the full test schedule refer to the documents listed above.
The testing also covers most of the requirements specified
by METI and CCC.
The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid.
Document Number: 28747
Revision: 06-May-10
CLAUSE
TEST PROCEDURES AND REQUIREMENTS
8.3.2
8.6.2
8.7.2
9.2.1
9.3.2
9.3.3
60127-4
IEC
METHOD
60068-2
21 (U
58 (Td)
58 (Td)
TEST
IEC
-
-
-
e1
)
characteristics
soldering heat
Resistance to
Time/current
Solderability
temperature
at nominal
resistance
Substrate
Breaking
Residual
bending
capacity
TEST
For technical questions, contact:
Cold resistance at 0.1 x I
destructive testing under
overcurrent conditions
(DC-Current)
Solder bath method; SnAg3Cu0.5 or SnAg3.5;
Thin Film Chip Fuses
Solder bath method; SnPb40;
(IR/forced gas convection);
(215 ± 3) °C; (3 ± 0.3) s
(245 ± 3) °C; (2 ± 0.2) s
(260 ± 5) °C; (10 ± 1) s
(260 ± 5) °C; (10 ± 1) s
50 A at rated voltage
50 A at rated voltage
Solder bath method;
non-activated flux;
non-activated flux;
acc. to UL 248-14
acc. to UL 248-14
Reflow method 2
PROCEDURE
Depth 1 mm;
rate 1 mm/s
R
;
1 times
[e-mail]
MFU 0402
MFU 0402 0.8 A ≤ I
MFU 0603
MFU 0805
MFU 1206
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on printed-circuit
boards in accordance with IEC 60127-4, unless otherwise
specified.
The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of IEC 60127-1 and IEC 60127-4
respectively. However, some additional tests and a number
of improvements against those minimum requirements have
been included.
I
R
I
I
I
R
R
R
≤ 0.75 A
≤ 5.0 A
≤ 5.0 A
≤ 6.3 A
R
≤ 3.15 A
Optical inspection with naked eye
Good tinning (≥ 95 % covered);
Good tinning (≥ 95 % covered);
Vishay Beyschlag
at 10 x I
at 10 x I
PERMISSIBLE CHANGE
At 1.25 x I
At 1.25 x I
at 2.0 x I
at 2.0 x I
Insulation resistance
higher than 0.1 MΩ
No visible damage
No visible damage
No visible damage
REQUIREMENTS
no visible damage
no visible damage
no visible damage
at 2.0 x U
ΔR/R ≤ ± 10 %
ΔR/R ≤ ± 10 %
ΔR/R ≤ ± 10 %
MFU Series
R
R
, t
, t
R
R
, t
pre-arc
pre-arc
R
R
, t
, t
, t
pre-arc
pre-arc
pre-arc
pre-arc
R
www.vishay.com
(DC)
< 0.001 s
< 0.001 s
< 60 s
< 5 s
> 1 h
> 1 h
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