N2510-6V0C-RB-WD 3M, N2510-6V0C-RB-WD Datasheet - Page 6

• Manufacturer Part Number: N2510-6V0C-RB-WD
• Description: CONN HEADER 10POS SMT VERT 30AU
• Manufacturer: 3M
• Series: 2500r
• Type: PCB Plugr

Specifications of N2510-6V0C-RB-WD

• Contact Type: Male Pin
• Connector Type: Header, Shrouded
• Number Of Positions: 10
• Number Of Positions Loaded: All
• Pitch: 0.100" (2.54mm)
• Number Of Rows: 2
• Row Spacing: 0.100" (2.54mm)
• Contact Mating Length: 0.243" (6.17mm)
• Mounting Type: Surface Mount
• Termination: Solder
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Color: Black
• Agency Approvals: cUL, UL
• Angle: Straight
• Brand/series: 2500 Series
• Contact Plating: Gold
• Current, Rating: 2 A
• Flammability Rating: UL94V-0
• Length, Overall: 0.788 "
• Length, Pin: 0.112 "
• Material, Contact: Copper Alloy
• Material, Housing: Glass Filled Polyester
• Number Of Contacts: 10
• Pin Spacing: 0.1 "
• Primary Type: High Temperature
• Special Features: Four-Wall
• Strain Relief: Low Profile
• Temperature, Operating: -55 to +105 °C
• Product Type: Headers - Shrouded
• Mounting Style: SMD/SMT
• Termination Style: Solder
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Fastening Type: -
• Lead Free Status / Rohs Status: RoHS Compliant part
• Other names: 5111174272; 51111742723; 800009103550; 80000913550; MSH10KTR; N25106V0CRBWD

Series 5100, 6800, 8500, 9100
6
2 mm x 2 mm, Solder Tail
Headers, 2 mm x 2 mm
Headers, .100" x .100"
Boardmount Pin Strips
Polarized Boardmount
Sockets, .100" x .100"
Sockets and Pin Strip
Sockets and Pin Strip
3M
2 mm, Series 95X
Pin Strip Headers
product
Box Headers
and Sockets
Series 95X
Series 957
Series 929
Series 15
™
BoardMount connector SolutionS
• RoHS Compliant
• Single and Dual Row
• 3 - 80 Positions
• High Temperature Dielectric
• “ No Lead” Wave and Reflow Solder
• Maximizes Use of PC Board Space
• End Stackable Feature
• Mates with Boardmount and
• Available in Straight, Right Angle
• RoHS Compliant
• Maximizes Use of PC Board Space
• High Temperature Dielectric
• “No Lead” Wave and Reflow Solder
• Dual Row Design, 4–80 Pins
• Minimized PC Board
• Mates With Pin Strip Header
• Available in Straight, Right Angle
• RoHS Compliant
• High Temperature Dielectric
• “No Lead” Wave and Reflow Solder
• Maximizes Use of PC Board Space
• Center Slot Polarization
• 10 - 68 Positions
• RoHS Compliant Version Available
• 2-72 Positions
• Single- and Dual-Row Options
• Through-Hole and Through-Board
• Customizable Stack Heights
• High Temperature Insulator Option
• RoHS Compliant
• 10-64 Positions
• Vertical and Right Angle Options
• Center Bump Polarization
• RoHS Compliant Version Available
• 4-60 Positions
• Single and Dual-Row Options
• Surfacemount, Through-Hole
• Customizable Stack Heights
• High Temperature Insulator
Wiremount Products
Through-Hole and Surfacemount
Versions
Compatible
Stacking Heights
Products
Through-Hole, Through-Board and
Surfacemount Versions
Compatible
Prevents Mis-Insertions and
Reduces Insertion Time
Options
from .150" to 1.325"
and Through-Board Options
from .101" to 1.418"
Compatible
FeatureS
Contact
Material: Copper Alloy
Insulation
Material: High Temperature
Color: Black
Flammability UL 94V-0
Plating
Underplating: 1.25–2.5 µm
Wiping Area: 0.25 µm [ 10 µ" ] Gold
Solder Tail Area: 1–3 µm
Contact
Material: Copper Alloy
Insulation
Material: High Temperature
Color: Black
Flammability UL 94V-0
Plating
Underplating: 1.25–2.5 µm
Wiping Area: 0.25 µm [ 10 µ" ] Gold
Solder Tail Area: 1–3 µm
Contact
Material: Square Pin 0.5 mm,
Insulation
Material: High Temperature
Thermoplastic
Color: Black
Flammability UL 94V-0
Plating
Underplating: 1.25–2.5 µm
Wiping Area: 0.25 µm [ 10 µ" ] Gold
Solder Tail Area: 1–3 µm
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Pin Strip Underplating: 50 µ"
Socket Underplating: 100 µ"
Tin Plated Versions Available
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Underplating: 2 µm [ 79 µ" ] Nickel
Wiping Area: 0.3 µm [ 12 µ" ] Gold
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled PCT
Flammability UL 94V-0
Plating
Underplating: 50-150 µ"
Wiping Area: 30 µ" [ 0.76 µm ] Gold
Thermoplastic
[ 100 µ" ] Nickel
[ 40–118 µ’" ] Matte Tin
Thermoplastic
[100 µ" ] Nickel
[ 40–118 µ" ] Matte Tin
Copper Alloy
[ 100 µ" ] Nickel
[ 40–118 µ" ] Matte Tin
(PBT) or PCT (RoHS Compliant)
[ 1.27 µm ] Nickel, Interface: 10 µ"
[ 0.25 µm ] or 30 µ" [ 0.76 µm ] Gold
[ 2.54 mm ] Nickel, Interface: 10 µ"
[ 0.25 µm ] or 30 µ" [ 0.76 µm ] Gold
[ 1.27-3.81 µm ] Nickel
MaterialS
3M.com/interconnects
perForMance
Current Rating: 1 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A, 2 A or 2.5 A
Temperature Rating: -40°C to +105°C
Current Rating: 1 A
Temperature Rating: -55°C to +105°C
Current Rating: 1 A
Temperature Rating: -55°C to +105°C