PM0603-12NJ JW Miller A Bourns Company, PM0603-12NJ Datasheet

INDUCTOR CHIP 12NH 5% SMD

PM0603-12NJ

Manufacturer Part Number
PM0603-12NJ
Description
INDUCTOR CHIP 12NH 5% SMD
Manufacturer
JW Miller A Bourns Company
Series
PM0603r
Type
Ceramicr
Datasheet

Specifications of PM0603-12NJ

Inductance
12nH
Current
700mA
Tolerance
±5%
Dc Resistance (dcr)
130 mOhm
Q @ Freq
30 @ 250MHz
Self Resonant Freq
4GHz
Package / Case
0603 (1608 Metric)
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C
Frequency - Test
250MHz
Material - Core
Ceramic
Applications
High Frequency
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Shielding
-
Current - Saturation
-
Current - Temperature Rise
-
Other names
M1238TR
PM060312NJ
REV. 10/08
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications
Bourns Part No.
PM0603-2N2-RC
PM0603-3N9-RC
PM0603-4N7-RC
PM0603-6N8J-RC
PM0603-8N2J-RC
PM0603-10NJ-RC
PM0603-12NJ-RC
PM0603-15NJ-RC
PM0603-18NJ-RC
PM0603-22NJ-RC
PM0603-27NJ-RC
PM0603-33NJ-RC
PM0603-39NJ-RC
PM0603-47NJ-RC
PM0603-56NJ-RC
PM0603-68NJ-RC
PM0603-72NJ-RC
PM0603-82NJ-RC
PM0603-R10J-RC
PM0603-R12J-RC
PM0603-R15J-RC
PM0603-R18J-RC
PM0603-R22J-RC
PM0603-R27J-RC
Packaging Specifi cations
Electrical Specifi cations
(7.00)
178.0
DIA.
(.827 ± .031)
21.0 ± 0.8
(.512 ± .020)
13.0 ± 0.5
DIA.
(.079 ± .020)
2.0 ± 0.5
100
120
150
180
220
270
nH
2.2
3.9
4.7
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
72
82
Inductance
Tol. % Min.
±15
±10
±10
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
(.512 ± .020)
13.0 ± 0.5
DIA.
(.492)
12.5
(.393)
10.0
16
16
16
25
30
30
30
30
30
35
35
35
35
35
35
35
34
34
34
32
28
25
25
25
Q
Test Frequency (MHz)
(1.969)
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
200
150
150
150
150
100
100
100
Features
PM0603 Series - High Q Chip Inductors
50.0
L
Formerly
0603 size
Available in E12 series
High Q up to 35 typ.
High operating temperature of 125 °C
Lead free
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
150
100
100
100
Q
J. W .Miller
(MHz)
6000
6000
5800
5800
5000
4800
4000
4000
3100
3000
2800
2300
2200
2100
1900
1700
1700
1700
1400
1350
1300
Min.
SRF
990
990
990
model
THICKNESS
(.004)
EMBOSSED
CARRIER
0.10
MAX.
RDC
0.08
0.08
0.10
0.11
0.11
0.13
0.13
0.17
0.17
0.19
0.22
0.22
0.25
0.28
0.31
0.34
0.49
0.54
0.71
0.79
0.92
1.25
1.90
2.30
(Ω)
(.315)
8.0
EMBOSSED
CAVITY
I rms
Max.
(mA)
700
700
700
700
700
700
700
700
700
700
600
600
600
600
600
600
400
400
400
300
280
240
200
170
Applications
Temperature Rise
Operating Temperature
Storage Temperature
Refl ow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
Core Material ............................. Alumina
Wire .......Enamelled Copper (1W1E180)
Terminal .......................... Mo/Mn+Ni+Au
Encapsulate ..........Epoxy (1EAS-UV300)
Packaging .................. 3,000 pcs per reel
Mobile phones
Cellular phones
CTV, VCR, HIC, FDD
General Specifi cations
Materials
Product Dimensions
Recommended Layout
.................20 ˚C max. at rated current
............................... -40 °C to +125 °C
............................... -40 °C to +125 °C
.............................260 ˚C, 10 seconds
REF.
(.014)
0.35
(.028)
REF.
0.7
(.014)
(.025)
0.35
0.64
DIMENSIONS:
(.065 ± .008)
1.65 ± 0.2
(1CC150707-302291))
(.040 ± .008)
(INCHES)
1.0 ± 0.2
MM
(.028)
(.041 ± .008)
(.047)
0.7
1.05 ± 0.2
1.2
(.014)
0.35
REF.
REF.

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