PIC16F526-I/SL Microchip Technology, PIC16F526-I/SL Datasheet - Page 19

IC PIC MCU FLASH 1KX12 14SOIC

PIC16F526-I/SL

Manufacturer Part Number
PIC16F526-I/SL
Description
IC PIC MCU FLASH 1KX12 14SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets

Specifications of PIC16F526-I/SL

Core Size
8-Bit
Program Memory Size
1.5KB (1K x 12)
Core Processor
PIC
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
11
Program Memory Type
FLASH
Ram Size
67 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 3x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Controller Family/series
PIC16F
No. Of I/o's
12
Eeprom Memory Size
64Byte
Ram Memory Size
67Byte
Cpu Speed
20MHz
No. Of Timers
1
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
67 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 3 Channel
A/d Bit Size
8 bit
A/d Channels Available
3
Height
1.25 mm
Length
8.65 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
3.9 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ICE2000 - EMULATOR MPLAB-ICE 2000 POD
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F526-I/SL
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC16F526-I/SL
0
6.0
TABLE 6-1:
© 2007 Microchip Technology Inc.
Genera
V
V
T
V
V
V
V
I
I
I
T
T
T
Serial Program/Verify
T
T
T
T
T
T
T
DDPROG
DDERA
PP
SET
ERA
VHHR
PROG
PPDP
HLD
HLD
DLY
DLY
DLY
DIS
IHH
IHL
IH
IL
DDOK
PROG
Sym.
1
1
1
1
2
3
0
1
PROGRAM/VERIFY MODE ELECTRICAL CHARACTERISTICS
l
V
mode entry
Voltage on MCLR to be in Normal mode
MCLR rise time (V
entry
Clock (RB1) and Data (RB0) input high-level
Clock (RB1) and Data (RB0) input low-level
Minimum V
High voltage on MCLR for programming
I
program memory
I
memory
MCLR pin current during Program/Verify mode
Programming time
Hold time after V
ISPCLK, ISPDATA hold time after MCLR↑
(Program/Verify mode selection pattern setup
time)
Data in setup time before clock↓
Data in hold time after clock↓
Data input not driven to next clock input (delay
required between command/data or
command/command)
Delay between clock↓ to clock↑ of next
command or data
Clock↑ to data out valid (during Read Data)
Bulk Erase Time
High Voltage Discharge Time
DD
DD
PP
level for programming operations,
level for Bulk Erase operations, program
High voltage on MCLR for Program/Verify
AC/DC TIMING REQUIREMENTS
DD
Characteristics
to perform Bulk Erase
PP
SS
to V
HH
) for Test mode
AC TARGETS
0.85*V
Min.
1000
12.5
12.5
V
100
100
100
4.5
1.0
1.0
80
5
5
4
SS
DD
Typ.
13.0
4.0
V
0.15*V
DD
Max.
2000
13.5
13.5
1.0
5.5
1.8
1.8
0.4
10
+ 1.0
DD
PIC16F526
Units
mA
mA
mA
ms
μs
μs
μs
μs
ns
ns
μs
μs
ns
μs
V
V
V
V
V
V
Total time to per-
form both stages
of Bulk Erase and
accept the next
command.
Time to dis-
charge high
voltage.
DS41317B-page 19
Conditions

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