PIC16F505-I/P Microchip Technology, PIC16F505-I/P Datasheet - Page 49
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PIC16F505-I/P
Manufacturer Part Number
PIC16F505-I/P
Description
IC MCU FLASH 1KX12 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC12F509T-ISN.pdf
(110 pages)
2.PIC16F505-IST.pdf
(4 pages)
3.PIC16F505-IST.pdf
(22 pages)
4.PIC12F509-EMC.pdf
(106 pages)
Specifications of PIC16F505-I/P
Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
11
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
72 B
Interface Type
RS- 232, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162070 - HEADER INTRFC MPLAB ICD2 8/14PAC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDM163029 - BOARD PICDEM FOR MECHATRONICSDVA16XP140 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
7.3.1
This configuration bit, when unprogrammed (left in the
‘1’ state), enables the external MCLR function. When
programmed, the MCLR function is tied to the internal
V
Figure 7-6.
FIGURE 7-6:
7.4
The PIC12F508/509/16F505 devices incorporate an
on-chip Power-on Reset (POR) circuitry, which
provides an internal chip Reset for most power-up
situations.
The on-chip POR circuit holds the chip in Reset until
V
ation. To take advantage of the internal POR, program
the (GP3/RB3)/MCLR/V
through a resistor to V
RB3). An internal weak pull-up resistor is implemented
using a transistor (refer to Table 10-2 for the pull-up
resistor ranges). This will eliminate external RC compo-
nents usually needed to create a Power-on Reset. A
maximum rise time for V
Section 10.0 “Electrical Characteristics” for details.
When the devices start normal operation (exit the
Reset condition), device operating parameters (volt-
age, frequency, temperature,...) must be met to ensure
operation. If these conditions are not met, the devices
must be held in Reset until the operating parameters
are met.
A simplified block diagram of the on-chip Power-on
Reset circuit is shown in Figure 7-7.
© 2007 Microchip Technology Inc.
MCLRE
DD
DD
GPWU/RBWU
has reached a high enough level for proper oper-
and the pin is assigned to be an input only. See
Power-on Reset (POR)
MCLR ENABLE
DD
MCLR SELECT
, or program the pin as (GP3/
PP
pin as MCLR and tie
DD
(GP3/RB3)/MCLR/V
is specified. See
Internal MCLR
PP
Preliminary
PIC12F508/509/16F505
The Power-on Reset circuit and the Device Reset
Timer (see Section 7.5 “Device Reset Timer (DRT)”)
circuit are closely related. On power-up, the Reset latch
is set and the DRT is reset. The DRT timer begins
counting once it detects MCLR to be high. After the
time-out period, which is typically 18 ms, it will reset the
Reset latch and thus end the on-chip Reset signal.
A power-up example where MCLR is held low is shown
in Figure 7-8. V
bringing MCLR high. The chip will actually come out of
Reset T
In Figure 7-9, the on-chip Power-on Reset feature is
being used (MCLR and V
is programmed to be (GP3/RB3). The V
before the start-up timer times out and there is no prob-
lem in getting a proper Reset. However, Figure 7-10
depicts a problem situation where V
The time between when the DRT senses that MCLR is
high and when MCLR and V
value, is too long. In this situation, when the start-up
timer times out, V
value and the chip may not function correctly. For such
situations, we recommend that external RC circuits be
used to achieve longer POR delay times (Figure 7-9).
For additional information, refer to Application Notes
AN522 “Power-Up Considerations” (DS00522) and
AN607 “Power-up Trouble Shooting” (DS00607).
Note:
DRT
When the devices start normal operation
(exit the Reset condition), device operat-
ing parameters (voltage, frequency, tem-
perature, etc.) must be met to ensure
operation. If these conditions are not met,
the device must be held in Reset until the
operating conditions are met.
msec after MCLR goes high.
DD
is allowed to rise and stabilize before
DD
has not reached the V
DD
are tied together or the pin
DD
actually reach their full
DD
DS41236D-page 47
rises too slowly.
DD
is stable
DD
(min)