PIC12HV615-I/SN Microchip Technology, PIC12HV615-I/SN Datasheet - Page 157

• Manufacturer Part Number: PIC12HV615-I/SN
• Description: IC PIC MCU FLASH 1KX14 8SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12HV615-I/SN

• Program Memory Type: FLASH
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 8-SOIC (3.9mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 5
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12H
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS-232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x09 mm Body [DFN]
© 2006 Microchip Technology Inc.
Note:
NOTE 1
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. § Significant Characteristic
4. Package is saw singulated
5. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
N
1
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
2
D
PIC12F609/615/12HV609/615
Dimension Limits
A1
Preliminary
E
A
Microchip Technology Drawing No. C04–131, Sept. 8, 2006
EXPOSED
Units
D2
A1
A3
E2
N
A
D
E
K
e
b
L
PAD
NOTE 2
K
MIN
0.80
0.00
0.00
0.00
0.25
0.30
0.20
MILLIMETERS
b
0.80 BSC
0.20 REF
4.00 BSC
4.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
2.20
3.00
0.30
0.55
—
8
D2
2
MAX
1.00
0.05
2.80
3.60
0.35
0.65
e
—
1
N
E2
DS41302A-page 155
NOTE 1
L