PIC16F616-I/P Microchip Technology, PIC16F616-I/P Datasheet - Page 155

• Manufacturer Part Number: PIC16F616-I/P
• Description: IC PIC MCU FLASH 2KX14 14DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F616-I/P

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Number Of I /o: 11
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 12
• Ram Memory Size: 128Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 14PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 11
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

15.10 Thermal Considerations
© 2009 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
*
θ
θ
T
PD
P
P
P
These parameters are characterized but not tested.
I
T
DD
A
JA
JC
DIE
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
PIC16F610/616/16HV610/616
85.0*
32.5*
31.0*
31.7*
100*
150*
2.6*
Typ
70*
37*
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x4mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x4mm package
PD = P
P
(NOTE 1)
P
P
(NOTE 2)
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
OL
(T
+ P
x V
DIE
) + Σ (I
DD
I
/
O
- T
DS41288F-page 155
A
OH
)/θ
* (V
JA
DD
- V
OH
))