PIC12F629-I/P Microchip Technology, PIC12F629-I/P Datasheet - Page 92

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PIC12F629-I/P

Manufacturer Part Number
PIC12F629-I/P
Description
IC MCU CMOS FLASH-BASE 8BIT 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr

Specifications of PIC12F629-I/P

Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
5
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Data Rom Size
128 B
Height
3.3 mm
Length
9.27 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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0
PIC12F629/675
12.5
DS41190G-page 92
D020E
D021E
D022E
D023E
D024E
D025E
D026E
Param
No.
Note 1: The peripheral current is the sum of the base I
DC Characteristics: PIC12F629/675-E (Extended)
† Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
Power-down Base Current
Device Characteristics
peripheral is enabled. The peripheral  current can be determined by subtracting the base I
current from this limit. Max values should be used when calculating total current consumption.
only and are not tested.
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
(I
PD
)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Min
0.00099
0.0012
0.0029
0.0012
0.0022
Typ†
11.5
109
138
0.3
1.8
8.4
3.3
6.1
4.0
4.6
6.0
58
58
85
Max
130
100
165
3.5
4.0
8.0
6.0
9.0
6.0
8.5
20
70
10
13
24
70
10
12
20
DD
or I
Units
-40C  T
PD
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
and the additional current consumed when this
V
A
2.0
3.0
5.0
2.0
3.0
5.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
3.0
5.0
DD
 +125C for extended
WDT, BOD, Comparators, V
and T1OSC disabled
WDT Current
BOD Current
Comparator Current
CV
T1 O
A/D Current
REF
 2010 Microchip Technology Inc.
SC
Conditions
Current
Current
(1)
(1)
(1)
Note
(1)
(1)
(1)
DD
DD
.
REF
or I
,
PD

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