PIC12C509A-04/SM Microchip Technology, PIC12C509A-04/SM Datasheet - Page 100
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PIC12C509A-04/SM
Manufacturer Part Number
PIC12C509A-04/SM
Description
IC MCU OTP 1KX12 8-SOIJ
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC12C508A-04SM.pdf
(113 pages)
2.PIC12C508A-04SM.pdf
(6 pages)
3.PIC12C508A-04SM.pdf
(16 pages)
4.PIC12C508A-04SM.pdf
(4 pages)
Specifications of PIC12C509A-04/SM
Core Size
8-Bit
Program Memory Size
1.5KB (1K x 12)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Ram Size
41 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
41Byte
Cpu Speed
4MHz
No. Of Timers
1
Digital Ic Case Style
SOIC
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
41 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
DVMCPA, ICE2000
Minimum Operating Temperature
0 C
Package
8SOIJ
Device Core
PIC
Family Name
PIC12
Maximum Speed
4 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT08SO-1 - SOCKET TRANSITION 8SOIC 150/208AC164312 - MODULE SKT FOR PM3 16SOICISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1048 - ADAPTER 8-SOIC TO 8-DIP309-1047 - ADAPTER 8-SOIC TO 8-DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12C509A-04/SM
Manufacturer:
MIC
Quantity:
1 485
Part Number:
PIC12C509A-04/SM
Manufacturer:
MIC
Quantity:
20 000
PIC12C5XX
Package Type:
DS40139E-page 100
Units
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Molded Package Width
Radius to Radius Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
†
‡
* Controlling Parameter.
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
K04-018 8-Lead Plastic Dual In-line (P) – 300 mil
eB
E1
E
R
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
‡
‡
†
2
1
c
D
MIN
0.014
0.055
0.000
0.006
0.140
0.060
0.005
0.120
0.355
0.245
0.267
0.310
5
5
A
A2
INCHES*
NOM
0.300
0.100
0.018
0.060
0.005
0.012
0.150
0.080
0.020
0.130
0.370
0.250
0.280
0.342
B1
B
10
10
8
MAX
0.022
0.065
0.010
0.015
0.160
0.100
0.035
0.140
0.385
0.260
0.292
0.380
15
15
MIN
0.36
1.40
0.00
0.20
3.56
1.52
0.13
3.05
9.02
6.22
6.78
7.87
MILLIMETERS
5
5
1999 Microchip Technology Inc.
NOM
p
7.62
2.54
0.46
1.52
0.13
0.29
3.81
2.03
0.51
3.30
9.40
6.35
7.10
8.67
A1
10
10
8
L
MAX
0.56
1.65
0.25
0.38
4.06
2.54
0.89
3.56
9.78
6.60
7.42
9.65
15
15