PIC16F716-I/P Microchip Technology, PIC16F716-I/P Datasheet - Page 61
![IC PIC MCU FLASH 2KX14 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16F716-I/P
Manufacturer Part Number
PIC16F716-I/P
Description
IC PIC MCU FLASH 2KX14 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F716-ISO.pdf
(136 pages)
4.PIC16F716-ISO.pdf
(12 pages)
5.PIC16F716-ESO.pdf
(126 pages)
Specifications of PIC16F716-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 8-bit
Package
18PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB16F716 - BOARD DAUGHTER ICEPIC3AC162054 - HEADER INTERFACE ICD2 16F716ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F716-I/P
Manufacturer:
MICROCHIP
Quantity:
5 373
Part Number:
PIC16F716-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
8.3.10
In Half-Bridge applications where all power switches
are modulated at the PWM frequency, the power
switches normally require more time to turn off than to
turn on. If both the upper and lower power switches are
switched at the same time (one turned on, and the
other turned off), both switches may be on for a short
period of time until one switch completely turns off.
During this brief interval, a very high current (shoot-
through current) will flow through both power switches,
shorting the bridge supply. To avoid this potentially
destructive shoot-through current from flowing during
switching, turning on either of the power switches is
normally delayed to allow the other switch to
completely turn off.
In Half-Bridge mode, a digitally programmable dead-
band delay is available to avoid shoot-through current
from destroying the bridge power switches. The delay
occurs at the signal transition from the non-active state
to the active state. See Figure 8-8 for illustration. The
lower seven bits of the associated PWM1CON register
(Register 8-3) sets the delay period in terms of
microcontroller instruction cycles (T
FIGURE 8-9:
© 2007 Microchip Technology Inc.
Standard Half-Bridge Circuit (“Push-Pull”)
PROGRAMMABLE DEAD-BAND
DELAY MODE
EXAMPLE OF HALF-BRIDGE APPLICATIONS
CY
or 4 T
P1A
P1B
OSC
).
FET
Driver
FET
Driver
FIGURE 8-8:
P1A
P1B
td = Dead-Band Delay
Note 1: At this time, the TMR2 register is equal to the
(2)
(2)
V+
V-
2: Output signals are shown as active-high.
(1)
td
Pulse Width
PR2 register.
Load
Period
td
EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
+
V
-
+
V
-
PIC16F716
(1)
Period
DS41206B-page 59
(1)