PIC16F630-I/SL Microchip Technology, PIC16F630-I/SL Datasheet - Page 120
![IC MCU FLASH 1KX14 EEPROM 14SOIC](/photos/6/59/65933/150-14-soic_sml.jpg)
PIC16F630-I/SL
Manufacturer Part Number
PIC16F630-I/SL
Description
IC MCU FLASH 1KX14 EEPROM 14SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F629T-ISN.pdf
(24 pages)
3.PIC16F630-ISL.pdf
(132 pages)
4.PIC16F630-ISL.pdf
(2 pages)
5.PIC16F630-ISL.pdf
(10 pages)
6.PIC16F676-EP.pdf
(132 pages)
7.PIC16F676-ISL.pdf
(130 pages)
Specifications of PIC16F630-I/SL
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Package
14SOIC N
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F630-I/SL
Manufacturer:
TriQuint
Quantity:
1 200
Company:
Part Number:
PIC16F630-I/SL
Manufacturer:
MICROCHI
Quantity:
1 743
Part Number:
PIC16F630-I/SL
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F630/676
14.2
The following sections give the technical details of the
packages.
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS40039C-page 118
Package Details
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
n
β
E1
eB
E
Dimension Limits
2
1
§
c
D
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
α
β
A
A1
MIN
.140
.115
.015
.300
.240
.740
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.750
.130
.012
.058
.018
.370
14
10
10
B
B1
MAX
.170
.145
.325
.260
.760
.135
.015
.070
.022
.430
15
15
MIN
18.80
3.56
0.38
6.10
3.18
0.20
0.36
7.87
2.92
7.62
1.14
p
5
5
MILLIMETERS
2003 Microchip Technology Inc.
α
NOM
19.05
6.35
2.54
3.94
3.30
7.94
3.30
0.29
1.46
0.46
9.40
A2
14
10
10
L
MAX
19.30
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15