PIC12C508-04/P Microchip Technology, PIC12C508-04/P Datasheet - Page 4

• Manufacturer Part Number: PIC12C508-04/P
• Description: IC MCU OTP 512X12 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12C508-04/P

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Type: OTP
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Ram Memory Size: 25Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Digital Ic Case Style: DIP
• Processor Series: PIC12C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 25 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 8
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: DVMCPA, ICE2000
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVMCPA - KIT DVR BOARD EVAL SYSTEM MXDEV1DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC12C508/509
2.
The package information contained in the data sheet is
incorrect. Please refer to the following tables for correct
package data.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS80023C-page 4
Module: Packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
β
eB
E1
E
Dimension Limits
§
Units
2
1
A2
E1
B1
eB
A1
p
A
E
D
B
α
n
L
c
β
c
D
MIN
.045
.140
.115
.015
.300
.240
.360
.125
.008
.014
.310
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
 2003 Microchip Technology Inc.
NOM
α
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
MAX
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15