PIC16F722-I/SP Microchip Technology, PIC16F722-I/SP Datasheet - Page 228
PIC16F722-I/SP
Manufacturer Part Number
PIC16F722-I/SP
Description
IC PIC MCU FLASH 2KX14 28-DIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.AC164112.pdf
(302 pages)
2.PIC16F722-ISS.pdf
(8 pages)
3.PIC16F722-ISS.pdf
(10 pages)
4.PIC16F722-ISS.pdf
(32 pages)
5.PIC16F722-ISS.pdf
(2 pages)
6.PIC16F722-ISS.pdf
(8 pages)
7.PIC16LF724-EP.pdf
(266 pages)
Specifications of PIC16F722-I/SP
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
25
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
25
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 11 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F722-I/SP
Manufacturer:
ABOV
Quantity:
3 000
Part Number:
PIC16F722-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- AC164112 PDF datasheet
- PIC16F722-ISS PDF datasheet #2
- PIC16F722-ISS PDF datasheet #3
- PIC16F722-ISS PDF datasheet #4
- PIC16F722-ISS PDF datasheet #5
- PIC16F722-ISS PDF datasheet #6
- PIC16LF724-EP PDF datasheet #7
- Current page: 228 of 302
- Download datasheet (5Mb)
PIC16F72X/PIC16LF72X
TABLE 23-4:
DS41341E-page 228
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C ≤ T
Param
30
31
32
33*
34*
35
36*
37*
Note 1: Instruction cycle period (T
No.
*
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
2: By design.
3: Period of the slower clock.
4: To ensure these voltage tolerances, V
T
T
T
T
T
V
V
T
These parameters are characterized but not tested.
only and are not tested.
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no
clock) for all devices.
possible. 0.1 μF and 0.01 μF values in parallel are recommended.
OST
MC
WDTLP
PWRT
IOZ
BORDC
BOR
HYST
Sym.
L
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,
AND BROWN-OUT RESET PARAMETERS
MCLR Pulse Width (low)
Low Power Watchdog Timer Time-
out Period (No Prescaler)
Oscillator Start-up Timer Period
(2)
Power-up Timer Period, PWRTE = 0
I/O high-impedance from MCLR Low
or Watchdog Timer Reset
Brown-out Reset Voltage
Brown-out Reset Hysteresis
Brown-out Reset DC Response
Time
Characteristic
A
CY
≤ +125°C
) equals four times the input oscillator time base period. All specified values are
DD
(1),
and V
SS
Min.
2.38
1.80
10
—
40
—
2
5
0
1
must be capacitively decoupled as close to the device as
Typ†
1024
2.5
1.9
18
65
25
—
—
—
3
Max. Units
2.73
2.11
140
2.0
50
10
—
—
27
—
5
Tosc (Note 3)
mV
ms
ms
μs
μs
μs
μs
V
V
V
V
BORV=2.5V
BORV=1.9V
V
V
-40°C to +85°C
© 2009 Microchip Technology Inc.
DD
DD
DD
DD
DD
= 3.3-5V, -40°C to +85°C
= 3.3-5V
= 3.3V-5V
≤ V
≤ V
BOR
BOR
Conditions
, -40°C to +85°C
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