PIC16F676-I/P Microchip Technology, PIC16F676-I/P Datasheet - Page 12
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PIC16F676-I/P
Manufacturer Part Number
PIC16F676-I/P
Description
IC MCU FLASH 1K W/AD 14-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F629T-ISN.pdf
(24 pages)
3.PIC16F630-ISL.pdf
(132 pages)
4.PIC16F630-ISL.pdf
(2 pages)
5.PIC16F630-ISL.pdf
(10 pages)
6.PIC16F676-EP.pdf
(132 pages)
Specifications of PIC16F676-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Data Rom Size
128 B
Height
3.3 mm
Length
19.05 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F676-I/P
Manufacturer:
RENESAS
Quantity:
5 600
Part Number:
PIC16F676-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC12F629/675/PIC16F630/676
2.3.1.10
To perform a bulk erase of the data memory, the
following sequence must be performed.
1.
2.
Data memory won’t erase if code-protected (CPD = 0).
FIGURE 2-13:
DS41191D-page 12
Note:
CLOCK
GP1
GP0
Do a Bulk Erase Data Memory command.
Wait T
Note 1: GP0 and GP1 apply to PIC12F629/675 only. For PIC16F630/676, use RA0 and RA1, respectively.
DATA
(1)
(1)
ERA
All bulk erase operations must take place
at 4.5V to 5.5V V
675/PIC16F630/676 devices and 2.0V to
5.5V V
Bulk Erase Data Memory
to complete bulk erase.
DD
for PIC16F630-ICD device.
BULK ERASE DATA MEMORY COMMAND
DD
1
1
range for PIC12F629/
2
1
Program/Verify Test mode
T
3
0
SET
1
4
1
T
HLD
5
1
x
x
6
T
T
ERA
DLY
© 2005 Microchip Technology Inc.
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