PIC12C508-04/SM Microchip Technology, PIC12C508-04/SM Datasheet
PIC12C508-04/SM
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PIC12C508-04/SM Summary of contents
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... PIC12C508/509 Data Sheet Errata The PIC12C5XX parts conform functionally to the PIC12C5XX Data Sheet (DS40139E), except for the anomalies described below: None 2003 Microchip Technology Inc. PIC12C508/509 Clarifications/Corrections to the Data Sheet: In the Device Data Sheet (DS40139E), the following clarifications and corrections should be noted. ...
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... PIC12C508/509 11.2 DC CHARACTERISTICS: PIC12C508/509 (Commercial, Industrial, Extended) DC CHARACTERISTICS Param Characteristic No. Input High Voltage I/O ports D040 with TTL buffer D040A (7) D070 GPIO weak pull-up current (2), (3) Input Leakage Current (5) D061 GP3/MCLR (6) D061A GP3/MCLR † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested ...
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... TABLE 11-1: PULL-UP RESISTOR RANGES - PIC12C508/C509 V DD (Volts) Temperature (°C) 2.5 - 125 5.5 - 125 2.5 - 125 5.5 - 125 * These parameters are characterized but not tested. Note 1: The weak pull-up resistor and associated current for the GP3/MCLR pin is non-linear when the respective ...
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... PIC12C508/509 2. Module: Packaging The package information contained in the data sheet is incorrect. Please refer to the following tables for correct package data. 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP β eB Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane ...
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... L .020 .025 .030 φ .008 .009 .010 B .014 .017 .020 α β PIC12C508/509 α A2 MILLIMETERS MIN NOM MAX 8 1.27 1.78 1.97 2.03 1.75 1.88 1.98 0.05 0.13 0.25 7.62 7.95 8.26 5.11 5.28 5.38 5.13 5.21 5.33 0.51 ...
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... PIC12C508/509 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil Dimension Limits Number of Pins Pitch Top to Seating Plane Top of Body to Seating Plane Standoff Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing § ...
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... L .019 .025 .030 φ .008 .009 .010 B .013 .017 .020 α β PIC12C508/509 α A2 MILLIMETERS MIN NOM MAX 8 1.27 1.35 1.55 1.75 1.32 1.42 1.55 0.10 0.18 0.25 5.79 6.02 6.20 3.71 3.91 3.99 4.80 4.90 5.00 0.25 ...
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... PIC12C508/509 8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN- TOP VIEW α A1 Units Dimension Limits n Number of Pins p Pitch Overall Height A Molded Package Thickness A2 Standoff A1 Base Thickness A3 Overall Length E Molded Package Length E1 Exposed Pad Length E2 Overall Width D Molded Package Width D1 Exposed Pad Width ...
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... APPENDIX A: REVISION HISTORY Rev. C Document (3/2003) Under Clarifications/Corrections to the Data Sheet, Item 2, Packaging: correct package data was added. Added Appendix A: Revision History. 2003 Microchip Technology Inc. PIC12C508/509 DS80023C-page 9 ...
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... PIC12C508/509 NOTES: DS80023C-page 10 2003 Microchip Technology Inc. ...
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... Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP service mark of Microchip Technology Incorporated in the U.S.A. ...
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... Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No ...