PIC18F24K20-I/SS Microchip Technology, PIC18F24K20-I/SS Datasheet - Page 9
![IC PIC MCU FLASH 8KX16 28SSOP](/photos/6/81/68119/150-28-ssop_sml.jpg)
PIC18F24K20-I/SS
Manufacturer Part Number
PIC18F24K20-I/SS
Description
IC PIC MCU FLASH 8KX16 28SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(12 pages)
3.PIC18F25K20T-ISS.pdf
(14 pages)
4.PIC18F25K20T-ISS.pdf
(456 pages)
5.PIC18F26K20-ISO.pdf
(430 pages)
Specifications of PIC18F24K20-I/SS
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
28-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
CCP/ECCP/EUSART/I2C/MSSP/SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Operating Supply Voltage
3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Package
28SSOP
Device Core
PIC
Family Name
PIC18
Maximum Speed
64 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F24K20-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F24/25/44/45K20
APPENDIX A:
DOCUMENT
REVISION HISTORY
Rev A Document (02/2008)
First revision of this document.
Rev B Document (05/12/08)
Added Module 20: POR, updating subsequent
numbering. Updated Module 5: ADC, Work around
2
description. Added Module 8 MSSP I
C, updating
subsequent numbering. Revised Module 22: Clocks,
added silicon revs.
Rev C Document (08/2008)
Revised Module 22; Added Modules 27 and 28.
Rev D Document (01/2009)
Revised Module 21; Added Module 29.
Rev E Document (05/2009)
Updated Errata to new format; Deleted Module 8:
2
MSSP I
C and Module 23: Comparators; Renumbered
Modules; Added Module 28: ADC; minor edits.
Clarifications/Corrections to the Data Sheet: Added
Module 1: MSSP; Module 2: Electrical Specifications;
Module 3: Electrical Specifications.
Rev F Document (06/2009)
Clarifications/Corrections to the Data Sheet:
Deleted Module 1: MSSP: Figure 17-17 Baud Rate
Generator Block Diagram, updating subsequent num-
bering. Added Module 3 MSSP: Register 17-3
SSPADD; Added Module 4 MSSP: Section 17.4.2
Operation; Added Module 5 MSSP: Figure 17-16
MSSP Block Diagram; Added Module 6 MSSP: Sec-
tions 17.4.7.1, 17.4.8, 17.4.9, 17.4.17.1, 17.4.17.2,
17.4.17.3: SSPADD, changing <6:0> to <7:0>.
Rev G Document (10/2009)
Updated the title of the errata.
Data Sheet Clarifications: Updated the errata deleting
Modules 1, 2, 3, 4, 5, 6.
© 2009 Microchip Technology Inc.
DS80366G-page 9