PIC16F628A-I/P Microchip Technology, PIC16F628A-I/P Datasheet - Page 167
![IC MCU FLASH 2KX14 EEPROM 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16F628A-I/P
Manufacturer Part Number
PIC16F628A-I/P
Description
IC MCU FLASH 2KX14 EEPROM 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F627A-IP.pdf
(180 pages)
2.PIC16F627A-IP.pdf
(22 pages)
3.PIC16F627A-ISO.pdf
(168 pages)
4.PIC16F648A-ISS.pdf
(178 pages)
Specifications of PIC16F628A-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
224 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
224 B
Interface Type
SCI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Package
18PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF648 - BOARD DAUGHTER ICEPIC3AC162053 - HEADER INTERFACE ICD,ICD2 18DIPACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F628A-I/P
Manufacturer:
BT
Quantity:
562
Company:
Part Number:
PIC16F628A-I/P
Manufacturer:
MICROCHI
Quantity:
850
Part Number:
PIC16F628A-I/P
Manufacturer:
MICROCHIP
Quantity:
20 000
© 2007 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
A1
EXPOSED
E
A
NOTE 1
PAD
PIC16F627A/628A/648A
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.50
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
MAX
1.00
0.05
0.70
4.20
4.20
0.35
–
L
DS40044F-page 165
b
K