PIC18F14K22-I/ML Microchip Technology, PIC18F14K22-I/ML Datasheet - Page 3

• Manufacturer Part Number: PIC18F14K22-I/ML
• Description: IC PIC MCU FLASH 512KX16 20-QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F14K22-I/ML

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Core Processor: PIC
• Speed: 64MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Controller Family/series: PIC18
• No. Of I/o's: 18
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 512Byte
• Cpu Speed: 64MHz
• No. Of Timers: 4
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, MSSP, SPI, USART
• Maximum Clock Frequency: 64 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• Package: 20QFN EP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 64 MHz
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Height: 0.88 mm
• Length: 4 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V, 2.7 V
• Width: 4 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Silicon Errata Issues
1. Module: ADC (Analog-to-Digital
 2010 Microchip Technology Inc.
Note:
1.1
Affected Silicon Revisions
A3
X
large INL error up to approximately 8 LSb.
Work around
None for the AN3 pin. For better accuracy,
use another analog pin.
ADC conversion on AN3/OSC2 will have
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A8).
A7
X
Converter)
A8
X
PIC18F1XK22/LF1XK22
1.2
1. When F
2. The ADC is operating from its dedicated
Work around
Method 1:
Method 2: Select the dedicated FRC
Method 3: Method 3 is provided if the
these conditions:
An ADC conversion may not complete under
the clock source used for the ADC
converter.
internal FRC oscillator and the device is
not in Sleep mode (an F
When this occurs, the ADC Interrupt
Fag (ADIF) does not get set, the GO/
DONE bit does not get cleared, and the
conversion result does not get loaded
into the ADRESH and ADRESL result
registers.
OSC
as the ADC clock source and
reduce the F
MHz or less when performing
ADC conversions.
oscillator
conversion clock source and
perform all conversions with the
device in Sleep.
application cannot use Sleep
mode and requires continuous
operation at frequencies above
8 MHz. This method requires
early termination of an ADC
conversion. Provide a fixed time
delay in software to stop the A-
to-D conversion manually, after
all 10 bits are converted, but
before the conversion would
complete
conversion
clearing the GO/DONE bit in
software. The GO/DONE bit
must be cleared during the last
½
conversion
completed automatically. Refer
to Figure 1 for details.
Select the system clock, F
is greater than 8 MHz and is
T
AD
cycle,
automatically.
OSC
as
OSC
is
DS80437D-page 3
would
frequency to 8
frequency).
stopped
before
the
have
ADC
OSC
The
the
by
,