PIC16LF628A-I/SO Microchip Technology, PIC16LF628A-I/SO Datasheet - Page 164

• Manufacturer Part Number: PIC16LF628A-I/SO
• Description: IC MCU FLASH 2KX14 EEPROM 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16LF628A-I/SO

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 224 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC16LF
• No. Of I/o's: 16
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 224Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 18SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 16
• Interface Type: USART
• Number Of Timers: 3
• Processor Series: PIC16LF
• Core: PIC
• Data Ram Size: 224 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Converters: -
• Lead Free Status / Rohs Status: Details

PIC16F627A/628A/648A
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS40044F-page 162
Note:
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
1
N
2
b
b1
3
D
Dimension Limits
Units
eB
A2
A1
E1
b1
N
A
E
D
e
L
c
b
E1
A2
.115
.015
.300
.240
.880
.115
.008
.045
.014
MIN
–
–
L
.100 BSC
INCHES
NOM
.310
.900
.130
.060
.018
.130
.250
.010
18
–
–
–
Microchip Technology Drawing C04-007B
© 2007 Microchip Technology Inc.
E
MAX
.210
.195
.325
.280
.920
.150
.014
.070
.022
.430
B
–
c