PIC16F72-I/SO Microchip Technology, PIC16F72-I/SO Datasheet - Page 3
![IC PIC MCU FLASH 2KX14 28-SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16F72-I/SO
Manufacturer Part Number
PIC16F72-I/SO
Description
IC PIC MCU FLASH 2KX14 28-SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F72-ISO.pdf
(136 pages)
5.PIC16F72-ISO.pdf
(6 pages)
6.PIC16F72-ISO.pdf
(136 pages)
Specifications of PIC16F72-I/SO
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F72-I/SO
Manufacturer:
MICROCHIP
Quantity:
3 290
Part Number:
PIC16F72-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
4. Module: Package Marking Information
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN) –
With 0.55 mm Contact Length (Saw Singulated)
© 2005 Microchip Technology Inc.
The package drawing on page 121 of the Device
Data Sheet no longer applies; refer to the package
information below.
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Drawing No. C04-105
A1
*Controlling Parameter
Notes:
JEDEC equivalent: MO-220
TOP VIEW
Dimension Limits
E
Units
D2
A1
A3
E2
n
e
A
E
D
b
L
OPTIONAL
INDEX
AREA
MIN
D
.031
.000
.232
.140
.232
.140
.009
.018
EXPOSED
METAL
INDICATORS
A
ALTERNATE
PAD OUTLINE
.008 REF
PAD
.026 BSC
INCHES
ALTERNATE
NOM
D2
28
INDEX
DETAIL
.035
.001
.236
.146
.236
.146
.011
.022
2
1
The solder mask drawing for the 28-pin QFN
package on page 122 of the Device Data Sheet
has been omitted. This drawing is from older
documentation and no longer applies.
MAX
n
.002
.240
.152
.240
.152
.013
.024
.039
BOTTOM VIEW
SEE DETAIL
E2
MIN
0.80
0.00
5.90
3.55
5.90
3.55
0.23
0.45
MILLIMETERS*
0.65 BSC
0.20 REF
PIC16F72
NOM
28
Revised 02-18-05
L
0.90
0.02
6.00
3.70
6.00
3.70
0.28
0.55
DS80155C-page 3
b
e
MAX
1.00
0.05
6.10
3.85
6.10
3.85
0.33
0.65