PIC16F72-I/SO Microchip Technology, PIC16F72-I/SO Datasheet - Page 123

IC PIC MCU FLASH 2KX14 28-SOIC

PIC16F72-I/SO

Manufacturer Part Number
PIC16F72-I/SO
Description
IC PIC MCU FLASH 2KX14 28-SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F72-I/SO

Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F72-I/SO
Manufacturer:
MICROCHIP
Quantity:
3 290
Part Number:
PIC16F72-I/SO
Quantity:
5 510
Part Number:
PIC16F72-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
28-Lead Plastic Quad Flat No Leads Package (ML) 6x6 mm Body (QFN)
2002 Microchip Technology Inc.
Notes:
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
A1
CH x 45
* Controlling Parameter
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-114
TOP VIEW
E1
E
Dimension Limits
n
Units
CH
A2
A1
A3
E1
E2
D1
D2
Q
A
E
D
B
R
n
p
L
2
1
MIN
D1
A2
.000
.140
.140
.009
.020
.005
.012
.009
D
A3
.008 REF.
INCHES
.026 BSC
.236 BSC
.226 BSC
.236 BSC
.226 BSC
A
NOM
D2
.0004
.033
.026
.146
.146
.011
.024
.007
.016
.017
28
R
EXPOSED
MAX
METAL
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
PADS
12
BOTTOM VIEW
MIN
E2
0.00
3.55
3.55
0.23
0.50
0.13
0.30
0.24
MILLIMETERS*
0.20 REF.
0.65 BSC
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
PIC16F72
NOM
0.85
0.65
0.01
3.70
3.70
0.28
0.60
0.17
0.40
0.42
L
DS39597B-page 121
28
MAX
Q
B
p
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
12

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