PIC16F72-I/SP Microchip Technology, PIC16F72-I/SP Datasheet - Page 633
PIC16F72-I/SP
Manufacturer Part Number
PIC16F72-I/SP
Description
IC PIC MCU FLASH 2KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F72-ISO.pdf
(136 pages)
5.PIC16F72-ISO.pdf
(6 pages)
6.PIC16F72-ISO.pdf
(136 pages)
Specifications of PIC16F72-I/SP
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C, SPI, SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 5 Channel
Data Rom Size
8 B
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
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Quantity
Price
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- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F72-ISO PDF datasheet #4
- PIC16F72-ISO PDF datasheet #5
- PIC16F72-ISO PDF datasheet #6
- Current page: 633 of 688
- Download datasheet (3Mb)
31.3.6
31.3.7
1997 Microchip Technology Inc.
Tested Crystals and Their Capacitor Values
Example EPROM Memory Erase Times
This table shows the crystal frequency and manufacturer that was used for every tests in this sec-
tion, as well as the capacitor values/ranges that exhibited the best characteristics.
Table 31-2: Example Capacitor Selection for Crystal Oscillators
The UV erase time of an EPROM cell depends on the geometry size of the EPROM cell and the
manufacturing technology.
device.
Table 31-3: Example of Typical EPROM Erase Time Recommendations
Table 31-4:
Note 1: If these criteria are not met, the erase times will be different.
Note:
Example
Device
Crystals Used:
Section 31. Device Characteristics
1
2
3
4
Osc Type
200 kHz
20 MHz
32 kHz
1 MHz
4 MHz
8 MHz
HS
LP
XT
Higher capacitance increases the stability of the oscillator but also increases the start-up time.
These values are for design guidance only.
mode to avoid overdriving crystals with low drive level specification. Since each crystal has its
own characteristics, the user should consult the crystal manufacturer for appropriate values of
external components or verify oscillator performance.
Refer to the device data sheet for the typical erase times for a device.
(Angstroms)
Wavelength
2537
2537
2537
2537
Crystal Frequency
Table 31-3
200 kHz
200 kHz
20 MHz
EPSON CA-301 20.000M-C
32 kHz
1 MHz
4 MHz
4 MHz
8 MHz
EPSON CA-301 8.000M-C
Epson C-001R32.768K-A
STD XTL 200.000KHz
shows some of the expected erase times for each different
ECS ECS-10-13-1
ECS ECS-40-20-1
( W/cm
Intensity
12,000
12,000
12,000
12,000
Capacitor Range
2
)
Rs
may be required in HS mode as well as XT
47-68 pF
15-33 pF
15-33 pF
Distance from UV
C1
lamp (inches)
33 pF
15 pF
15 pF
15 pF
15 pF
1
1
1
1
Capacitor Range
DS31031A-page 31-21
Typical Time
20 PPM
20 PPM
50 PPM
50 PPM
30 PPM
30 PPM
47-68 pF
15-33 pF
15-33 pF
(minutes)
C2
15 - 20
33 pF
15 pF
15 pF
15 pF
15 pF
20
40
60
(1)
31
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