PIC12C672-10I/SM Microchip Technology, PIC12C672-10I/SM Datasheet - Page 21
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12C672-10I/SM
Manufacturer Part Number
PIC12C672-10I/SM
Description
IC MCU OTP 2KX14 A/D 8-SOIJ
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC12CE673-10P.pdf
(129 pages)
3.PIC12CE673-10P.pdf
(14 pages)
Specifications of PIC12C672-10I/SM
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
For Use With
XLT08SO-1 - SOCKET TRANSITION 8SOIC 150/208AC164312 - MODULE SKT FOR PM3 16SOICISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1048 - ADAPTER 8-SOIC TO 8-DIP309-1047 - ADAPTER 8-SOIC TO 8-DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
- Current page: 21 of 688
- Download datasheet (3Mb)
1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1
Related parts for PIC12C672-10I/SM
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![PIC12C672-04/P](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8DIP
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-04/SM](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8-SOIJ
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-10/SM](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8-SOIJ
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-10I/P](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8DIP
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-04E/SM](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8-SOIJ
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-10E/P](/photos/16/0/160065/8-pdip-angled-300dpi-lyrd_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8DIP
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-04I/MF](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8DFN
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-04E/MF](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC PIC MCU 2KX14 8DFN
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-10E/SM](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8-SOIJ
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-10I/MF](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8DFN
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-04I/P](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8DIP
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-04I/SM](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC MCU OTP 2KX14 A/D 8-SOIJ
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672/JW](/photos/12/43/124388/pic12c672_jw_tmb.jpg)
Part Number:
Description:
IC MCU EPROM 2KX14 A/D 8CDIP
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-04E/P](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,8PIN,PLASTIC
Manufacturer:
Microchip Technology
Datasheet:
![PIC12C672-10/P](/photos/16/0/160065/8-pdip-angled-300dpi-lyrd_tmb.jpg)
Part Number:
Description:
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,8PIN,PLASTIC
Manufacturer:
Microchip Technology
Datasheet: