PIC18LF24J50-I/SO Microchip Technology, PIC18LF24J50-I/SO Datasheet - Page 9
![IC PIC MCU FLASH 16K 2V 28-SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC18LF24J50-I/SO
Manufacturer Part Number
PIC18LF24J50-I/SO
Description
IC PIC MCU FLASH 16K 2V 28-SOIC
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18LF24J10-ISS.pdf
(32 pages)
2.PIC18LF24J50-ISS.pdf
(554 pages)
3.PIC18LF24J50-ISS.pdf
(12 pages)
Specifications of PIC18LF24J50-I/SO
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
16
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
16 KB
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
31 KHz
Number Of Programmable I/os
16
Number Of Timers
5
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183032, DM183022, MA180024, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
APPENDIX A:
Rev A Document (2/2009)
First release of this document. Silicon issues
1 (T1DIG),
6 (PMP), 7 (Deep Sleep), 8 (Supply Voltage).
Rev B Document (5/2009)
Added silicon issues 9 (Band Gap Reference) and
10 (Charge Time Measurement Unit – CTMU).
Rev C Document (1/2010)
Converted existing document for the A2 silicon revision
to the new, combined format. (There were no other
silicon errata or data sheet clarification documents for
the device family.)
Removed silicon issue 1 (Special Features, T1DIG)
and
2 (MSSP1) and 6 (Low-Power Modes – Deep Sleep).
Added data sheet clarifications 1 (Special Features –
CONFIG2L), 2 (DC Characteristics – Power-Down
Current) and 3 (DC Characteristics – Input Leakage).
2010 Microchip Technology Inc.
modified
2-3 (MSSP),
decremented
DOCUMENT
REVISION HISTORY
4 (EUSART),
issue
1,
5 (ADC),
formerly
PIC18F46J50 FAMILY
DS80436C-page 9