PIC16C554-04/SO Microchip Technology, PIC16C554-04/SO Datasheet - Page 97

• Manufacturer Part Number: PIC16C554-04/SO
• Description: IC MCU OTP 512X14 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C554-04/SO

• Core Size: 8-Bit
• Program Memory Size: 896B (512 x 14)
• Oscillator Type: External
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 13
• Program Memory Type: OTP
• Ram Size: 80 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC16C
• No. Of I/o's: 13
• Ram Memory Size: 80Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Digital Ic: RoHS Compliant
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 80 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 8
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1075 - ADAPTER 18-SOIC TO 18-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1011 - ADAPTER 18-SOIC TO 18-DIP309-1010 - ADAPTER 18-SOIC TO 18-DIPAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC16C554-04/SOR; PIC16C554-04/SOR

20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
 2002 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
β
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
B
n
p
L
c
φ
α
β
MIN
Preliminary
2
1
.068
.064
.002
.299
.278
.022
.004
.010
.201
0
0
0
D
φ
L
INCHES*
NOM
.026
.073
.068
.006
.309
.207
.284
.030
.007
.013
20
A1
5
5
4
A
MAX
.078
.072
.010
.322
.212
.289
.037
.010
.015
10
10
8
MIN
1.73
1.63
0.05
7.59
7.06
0.56
0.10
0.00
0.25
5.11
0
0
MILLIMETERS
PIC16C55X
NOM
101.60
0.65
1.85
1.73
0.15
7.85
5.25
7.20
0.75
0.18
0.32
20
5
5
DS40143D-page 95
MAX
203.20
A2
1.98
1.83
0.25
8.18
5.38
7.34
0.94
0.25
0.38
α
10
10