PIC16F913-I/SP Microchip Technology, PIC16F913-I/SP Datasheet - Page 259
PIC16F913-I/SP
Manufacturer Part Number
PIC16F913-I/SP
Description
IC PIC MCU FLASH 4KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F913-ISS.pdf
(330 pages)
3.PIC16F913-ISS.pdf
(8 pages)
4.PIC16F913-ISS.pdf
(34 pages)
5.PIC16F913-ISO.pdf
(274 pages)
Specifications of PIC16F913-I/SP
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SSP/I2C/AUSART/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F913-I/SP
Manufacturer:
TI
Quantity:
212
- PIC16F616T-ISL PDF datasheet
- PIC16F913-ISS PDF datasheet #2
- PIC16F913-ISS PDF datasheet #3
- PIC16F913-ISS PDF datasheet #4
- PIC16F913-ISO PDF datasheet #5
- Current page: 259 of 274
- Download datasheet (5Mb)
28-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
2004 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
JEDEC Equivalent: MO-150
Drawing No. C04-073
B
*Controlling Parameter
Notes:
c
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
p
n
Dimension Limits
E1
E
Units
A2
E1
A1
p
E
D
L
B
n
A
c
f
2
1
f
MIN
.065
.002
.295
.390
.022
.004
.009
.009
Preliminary
L
D
0°
-
INCHES
A1
NOM
28
.026
.307
.402
.030
.069
.209
4°
A
-
-
-
-
MAX
.079
.073
.323
.220
.413
.037
.010
.015
8°
-
MIN
1.65
0.05
7.49
5.00
9.90
0.55
0.09
0.22
0°
-
MILLIMETERS*
PIC16F91X
NOM
28
10.20
0.65
1.75
7.80
5.30
0.75
4°
-
-
-
-
DS41250B-page 257
A2
MAX
10.50
8.20
5.60
0.95
0.25
0.38
1.85
2.0
8°
-
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