PIC16C710-04I/P Microchip Technology, PIC16C710-04I/P Datasheet - Page 4
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PIC16C710-04I/P
Manufacturer Part Number
PIC16C710-04I/P
Description
IC MCU OTP 512X14 A/D 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C710-04I/P
Core Size
8-Bit
Program Memory Size
896B (512 x 14)
Core Processor
PIC
Speed
4MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Type
OTP
Ram Size
36 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Data Converters
A/D 4x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
Controller Family/series
PIC16C
No. Of I/o's
13
Ram Memory Size
36Byte
Cpu Speed
4MHz
No. Of Timers
1
Digital Ic Case Style
DIP
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
36 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
1
Operating Supply Voltage
2.5 V to 6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Details
PIC16C710/711
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
DS80154A-page 4
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Width
Window Length
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
W2
n
E1
W1
eB
E
Dimension Limits
§
2
1
Units
W1
W2
A2
eB
D
A1
E1
B1
A
E
D
B
n
p
L
c
c
A1
A
MIN
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
INCHES*
NOM
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
18
B
B1
MAX
.195
.165
.030
.325
.295
.920
.150
.012
.060
.425
.150
.210
.021
MIN
22.35
4.32
3.94
0.38
7.62
7.24
3.18
0.20
1.27
8.76
3.30
4.83
0.41
MILLIMETERS
p
2003 Microchip Technology Inc.
NOM
22.86
A2
0.25
2.54
4.64
4.06
0.57
7.94
7.37
3.49
1.40
0.47
9.78
3.56
5.08
18
L
MAX
23.37
10.80
4.95
4.19
0.76
8.26
7.49
0.30
1.52
0.53
5.33
3.81
3.81