PIC16F87-I/P Microchip Technology, PIC16F87-I/P Datasheet - Page 213
![IC MCU FLASH 4KX14 EEPROM 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16F87-I/P
Manufacturer Part Number
PIC16F87-I/P
Description
IC MCU FLASH 4KX14 EEPROM 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F87-IP.pdf
(228 pages)
5.PIC16F87-IP.pdf
(8 pages)
6.PIC16F87-IP.pdf
(4 pages)
7.PIC16F87-IP.pdf
(8 pages)
8.PIC16F87-IP.pdf
(24 pages)
9.PIC16F88-ISO.pdf
(214 pages)
Specifications of PIC16F87-I/P
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
SSP/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
Package
18PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F87-I/P
Manufacturer:
MICROCHIP
Quantity:
3 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F87-IP PDF datasheet #4
- PIC16F87-IP PDF datasheet #5
- PIC16F87-IP PDF datasheet #6
- PIC16F87-IP PDF datasheet #7
- PIC16F87-IP PDF datasheet #8
- PIC16F88-ISO PDF datasheet #9
- Current page: 213 of 228
- Download datasheet (5Mb)
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
2005 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Width
Molded Package Width
Exposed Pad Width
Overall Length
Molded Package Length
Exposed Pad Length
Lead Width
Lead Length
Tie Bar Width
Tie Bar Length
Chamfer
Mold Draft Angle Top
Drawing No. C04-114
A1
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: MO-220
CH X 45°
ı
α
TOP VIEW
Dimension Limits
E1
E
Units
CH
D1
D2
A2
A1
A3
E1
E2
ı α
n
Q
A
E
D
B
R
n
p
L
2
1
MIN
A2
D1
.000
.140
.140
.009
.020
.005
.012
.009
A3
D
A
INCHES
.026 BSC
.236 BSC
.226 BSC
.236 BSC
.226 BSC
.008 REF
NOM
28
.0004
.033
.026
.146
.146
.011
.024
.007
.016
.017
D2
R
MAX
EXPOSED
.039
.031
.002
.152
.152
.014
.030
.010
.026
.024
12°
METAL
PAD
BOTTOM VIEW
MIN
E2
0.00
3.55
3.55
0.23
0.50
0.13
0.30
0.24
PIC16F87/88
MILLIMETERS*
0.65 BSC
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
0.20 REF
NOM
28
0.85
0.65
0.01
3.70
3.70
0.28
0.60
0.17
0.40
0.42
L
DS30487C-page 211
MAX
Q
B
1.00
0.80
0.05
3.85
3.85
0.35
0.75
0.23
0.65
0.60
p
12°
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