PIC16F872-I/SP Microchip Technology, PIC16F872-I/SP Datasheet - Page 615
PIC16F872-I/SP
Manufacturer Part Number
PIC16F872-I/SP
Description
IC MCU FLASH 2KX14 EE 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F872-ISO.pdf
(168 pages)
5.PIC16F872-ISO.pdf
(5 pages)
6.PIC16F872-ISO.pdf
(6 pages)
7.PIC16F872-ISO.pdf
(168 pages)
Specifications of PIC16F872-I/SP
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C/SPI/SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
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- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16C770-ISO PDF datasheet #3
- PIC16F872-ISO PDF datasheet #4
- PIC16F872-ISO PDF datasheet #5
- PIC16F872-ISO PDF datasheet #6
- PIC16F872-ISO PDF datasheet #7
- Current page: 615 of 688
- Download datasheet (3Mb)
31.3.1
1997 Microchip Technology Inc.
I
PD
vs. V
DD
I
referred to as power-down current. These tests are taken with all I/O as inputs, either pulled high
or low. That is, there are no floating inputs, nor are any pins driving an output (with a load).
The characterization shows graphs for both the Watchdog Timer (WDT) disabled and enabled.
This is required since the WDT requires an on-chip RC oscillator which consumes additional cur-
rent.
Since the device may have certain features and modules that can operate while the device is in
sleep mode. Some of these modules are:
• Watchdog Timer (WDT)
• Brown-out Reset (BOR) circuitry
• Timer1
• Analog to Digital converter
• LCD module
• Comparators
• Voltage Reference
If these features are operating while the device is in sleep mode, a higher current will be con-
sumed. When all features are disabled, the device will consume the lowest possible current (the
leakage current). If more then one feature is enabled then the expected current can easily be cal-
culated as the base current (everything disabled and in sleep mode) plus all delta currents.
Example 31-1
WDT and Timer1 oscillator enabled.
Example 31-1:I
PD
Base Current
WDT Delta Current
Timer1 Delta Current
Total Sleep Current
is the current (I) that the device consumes when the device is in sleep mode (power-down),
Section 31. Device Characteristics
shows an example of calculating the typical currents for a device at 5V, with the
PD
Calculations with WDT and TIMER1 Oscillator Enabled (@ 5V)
14 nA
14 A
22 A
36 A
; Device leakage current
; 14 A - 14 nA = 14 A
; 22 A - 14 nA = 22 A
;
DS31031A-page 31-3
31
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