PIC16F872-I/SS Microchip Technology, PIC16F872-I/SS Datasheet

IC MCU FLASH 2KX14 EE 28SSOP

PIC16F872-I/SS

Manufacturer Part Number
PIC16F872-I/SS
Description
IC MCU FLASH 2KX14 EE 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F872-I/SS

Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC16F
No. Of I/o's
22
Eeprom Memory Size
64Byte
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
I2C, SPI, SSP
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3 bit
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164307 - MODULE SKT FOR PM3 28SSOPAC164020 - MODULE SKT PROMATEII 44TQFPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Lead Free Status / Rohs Status
 Details

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The PIC16F872 Rev. A2 parts you have received con-
form
(DS30221A), except for the anomalies described
below.
All the problems listed here will be addressed in future
revisions of the PIC16F872 silicon.
1. Module: Electrical Specifications
2. Programming Issues
 2001 Microchip Technology Inc.
Note:
The supply voltage specification has not yet met
the design target (data sheet specification). The
specification for these devices is shown in Table 1.
Problems may be experienced when programming
devices with date codes earlier than and including
0034NNN. These devices are shipped with Low
Voltage In-Circuit Serial Programming (ICSP)
(LVP) enabled. In this mode, the I/O pin, RB3, is
used to place the device in Programming mode.
Most programmers will leave this pin floating,
which may cause the device to enter Programming
mode before MCLR has been released from
ground. This sequence of events prevents the
device from entering Programming mode properly.
Work around
Connect a 10 kΩ resistor from pin RB3 to ground.
This resistor can be placed in the programming
socket when the device is programmed in a
programmer.
When programming, using ICSP with the device
mounted on the target board, pin RB3 must be
pulled or driven low during programming.
If Low Voltage ICSP Programming is not required
in the application, it should be disabled. All future
programming cycles will not require pin RB3 to be
pulled, or driven low after LVP is disabled.
functionally
As with any windowed EPROM device, please cover the window at all times, except when erasing.
PIC16F872 Rev. A2 Silicon Errata Sheet
to
the
Device
Data
Sheet
3. Module: Timer1
When Timer1 is running in Asynchronous mode
and then disabled, data in the Timer1 register
(TMR1) may become corrupted. Corruption occurs
when the timer enable is turned off at the same
instant that a ripple carry occurs in the timer
module.
This issue only occurs in asynchronous operation.
In synchronous operation, the relevant signals are
latched with the CPU clock and the problem condi-
tion does not arise.
Work around
When Timer1 is configured to operate as an asyn-
chronous counter, care must be taken that there is
no incoming pulse while the module is being
turned off. If an incoming pulse arrives while
Timer1 is being turned off, the value of register
TMR1 may become corrupted.
If an application requires that Timer1 be turned off,
and if it is possible that Timer1 may receive an
incoming pulse while being turned off, synchronize
the external clock first by clearing the T1SYNC bit
of register T1CON (T1CON<2>). Please note,
however, that this may cause Timer1 to miss up to
one count.
PIC16F872
DS80076B-page 1

Related parts for PIC16F872-I/SS

PIC16F872-I/SS Summary of contents

Page 1

... PIC16F872 Rev. A2 Silicon Errata Sheet The PIC16F872 Rev. A2 parts you have received con- form functionally to the Device (DS30221A), except for the anomalies described below. All the problems listed here will be addressed in future revisions of the PIC16F872 silicon. 1. Module: Electrical Specifications The supply voltage specification has not yet met the design target (data sheet specification) ...

Page 2

... PIC16F872 Clarifications/Corrections to the Data Sheet: In the Device Data Sheet (DS30221A), the following clarifications and corrections should be noted. 1. The supply voltage specification (parameter D001) has changed. The new value is shown in Table 1. TABLE 1: DC SPECIFICATION CHANGES FROM DATA SHEET Param. Symbol Characteristic No. ...

Page 3

... REVISION HISTORY Rev A Document (6/2000) Original errata document. Issues 1 (Electrical Specifications) and 2 (Programming Issues), page 1. Clarification of supply voltage (page 2). Correction of configuration word and code protection (page 2). Rev B Document (2/01) Issue 3 (Timer1), page 1.  2001 Microchip Technology Inc. PIC16F872 DS80076B-page 3 ...

Page 4

... PIC16F872 NOTES: DS80076B-page 4  2001 Microchip Technology Inc. ...

Page 5

... L , SEEVAL, MPLAB and The EE OQ Embedded Control Solutions Company are registered trade- marks of Microchip Technology Incorporated in the U.S.A. and other countries. Total Endurance, ICSP, In-Circuit Serial Programming, Filter- Lab, MXDEV, microID, FlexROM, fuzzyLAB, MPASM, MPLINK, MPLIB, PICDEM, ICEPIC, Migratable Memory, FanSense, ECONOMONITOR, SelectMode and microPort are trademarks of Microchip Technology Incorporated in the U ...

Page 6

... Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec- tual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. ...

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