PIC16LF870-I/SP Microchip Technology, PIC16LF870-I/SP Datasheet - Page 158
![IC MCU FLASH 2KX14 EE A/D 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16LF870-I/SP
Manufacturer Part Number
PIC16LF870-I/SP
Description
IC MCU FLASH 2KX14 EE A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Specifications of PIC16LF870-I/SP
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC16LF
No. Of I/o's
22
Eeprom Memory Size
64Byte
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
28 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
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PIC16F870/871
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS30569B-page 156
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
c
CH2 x 45
#leads=n1
Dimension Limits
n
E2
E1
1
E
2
CH1 x 45
Units
CH2
CH1
D2
A2
A3
E1
D1
E2
B1
n1
A1
A
E
D
B
n
p
c
D1
A2
MIN
.165
.145
.020
.024
.040
.000
.685
.685
.650
.650
.590
.590
.008
.026
.013
D
0
0
INCHES*
NOM
35
.050
.173
.153
.028
.029
.045
.005
.690
.690
.653
.653
.620
.620
.029
.020
.011
44
A
11
5
5
MAX
A3
.180
.160
.035
.034
.050
.010
.695
.695
.656
.656
.630
.630
.013
.032
.021
10
10
MIN
17.40
17.40
14.99
14.99
16.51
16.51
B1
4.19
3.68
1.02
0.00
0.20
0.66
0.33
D2
B
0.51
0.61
0
0
MILLIMETERS
p
2003 Microchip Technology Inc.
NOM
17.53
17.53
16.59
16.59
15.75
15.75
1.27
4.39
3.87
0.74
1.14
0.13
0.27
0.74
0.71
0.51
44
11
5
5
A1
MAX
17.65
17.65
16.66
16.66
16.00
16.00
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.53
0.81
10
10
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