DSPIC33FJ16MC304-I/ML Microchip Technology, DSPIC33FJ16MC304-I/ML Datasheet - Page 291
![IC DSPIC MCU/DSP 16K 44QFN](/photos/6/81/68122/150-44-qfn_sml.jpg)
DSPIC33FJ16MC304-I/ML
Manufacturer Part Number
DSPIC33FJ16MC304-I/ML
Description
IC DSPIC MCU/DSP 16K 44QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(320 pages)
2.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
3.DSPIC33FJ64MC202-ESO.pdf
(424 pages)
Specifications of DSPIC33FJ16MC304-I/ML
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 9x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
35
Flash Memory Size
16KB
Supply Voltage Range
3V To 3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164335 - MODULE SKT FOR 10X10 PM3 44TQFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ16MC304-I/ML
Manufacturer:
Microchip
Quantity:
235
- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC202-IMM PDF datasheet #2
- DSPIC33FJ64MC202-ESO PDF datasheet #3
- Current page: 291 of 320
- Download datasheet (5Mb)
26.2
© 2011 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
DS70283H-page 291
c
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