PIC18LF2410-I/SO Microchip Technology, PIC18LF2410-I/SO Datasheet - Page 358
PIC18LF2410-I/SO
Manufacturer Part Number
PIC18LF2410-I/SO
Description
IC MCU FLASH 8KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18LF2410-ISO.pdf
(376 pages)
2.PIC18LF2410-ISO.pdf
(8 pages)
3.PIC18LF2410-ISO.pdf
(16 pages)
4.PIC18LF2410-ISO.pdf
(6 pages)
5.PIC18LF2410-ISO.pdf
(6 pages)
6.PIC18LF2410-ISO.pdf
(8 pages)
Specifications of PIC18LF2410-I/SO
Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
25
Ram Memory Size
768Byte
Cpu Speed
40MHz
No. Of Timers
4
Interface
I2C, SPI, USART
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF2410-I/SO
Manufacturer:
TOSHIBA
Quantity:
3 000
- PIC18LF2410-ISO PDF datasheet
- PIC18LF2410-ISO PDF datasheet #2
- PIC18LF2410-ISO PDF datasheet #3
- PIC18LF2410-ISO PDF datasheet #4
- PIC18LF2410-ISO PDF datasheet #5
- PIC18LF2410-ISO PDF datasheet #6
- Current page: 358 of 376
- Download datasheet (7Mb)
PIC18F2X1X/4X1X
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS39636D-page 360
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
φ
E1
Units
A2
A1
E1
D1
L
L1
D
N
A
E
α
NOTE 2
e
L
φ
c
b
β
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.30
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
–
–
–
Microchip Technology Drawing C04-076B
© 2009 Microchip Technology Inc.
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
7°
A2
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