PIC16LF871-I/P Microchip Technology, PIC16LF871-I/P Datasheet - Page 156
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PIC16LF871-I/P
Manufacturer Part Number
PIC16LF871-I/P
Description
IC PIC MCU FLASH 2KX14 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Specifications of PIC16LF871-I/P
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Oscillator Type
External
Core Processor
PIC
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC16LF
No. Of I/o's
33
Eeprom Memory Size
64Byte
Ram Memory Size
128Byte
Cpu Speed
20MHz
No.
RoHS Compliant
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
PSP, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
33
Number Of Timers
8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
28 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16LF871-I/PT
Manufacturer:
TI
Quantity:
212
Company:
Part Number:
PIC16LF871-I/PT
Manufacturer:
MICROCHIP
Quantity:
3 000
Company:
Part Number:
PIC16LF871-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16LF871-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F870/871
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
DS30569B-page 154
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
n
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
E1
B1
eB
A1
A
E
D
B
A
n
p
L
c
A1
MIN
2.045
.160
.140
.015
.595
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
40
10
10
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
13.46
51.94
15.75
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
2003 Microchip Technology Inc.
NOM
15.24
13.84
52.26
16.51
2.54
4.45
3.30
0.29
1.27
0.46
3.81
40
10
10
p
MAX
A2
15.88
14.22
52.45
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15