PIC16F84A-04I/P Microchip Technology, PIC16F84A-04I/P Datasheet - Page 74
![IC MCU FLASH 1KX14 EE 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16F84A-04I/P
Manufacturer Part Number
PIC16F84A-04I/P
Description
IC MCU FLASH 1KX14 EE 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC16F84A-04P.pdf
(88 pages)
3.PIC16F84A-04P.pdf
(6 pages)
Specifications of PIC16F84A-04I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
13
Eeprom Size
64 x 8
Ram Size
68 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
68 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
13
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB16F84A - BOARD DAUGHTER ICEPIC3DVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F84A-04I/P
Manufacturer:
MICROCHIP
Quantity:
4 500
PIC16F84A
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS35007B-page 72
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
eB
A2
A1
E1
B1
D
n
p
A
E
L
c
B
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.430
.022
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
2001 Microchip Technology Inc.
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15