PIC24HJ32GP304-E/ML Microchip Technology, PIC24HJ32GP304-E/ML Datasheet - Page 82
![IC PIC MCU FLASH 32K 44-QFN](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC24HJ32GP304-E/ML
Manufacturer Part Number
PIC24HJ32GP304-E/ML
Description
IC PIC MCU FLASH 32K 44-QFN
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP302-ISO.pdf
(368 pages)
3.PIC24HJ32GP302-ISO.pdf
(8 pages)
4.PIC24HJ32GP302-ISO.pdf
(12 pages)
5.PIC24HJ32GP304-EML.pdf
(356 pages)
Specifications of PIC24HJ32GP304-E/ML
Program Memory Type
FLASH
Program Memory Size
32KB (11K x 24)
Package / Case
44-QFN
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
35
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
35
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit or 13-ch x 12-bit
Height
0.88 mm
Length
8 mm
Supply Voltage (max)
3.6 V, 3.9 V
Supply Voltage (min)
2.7 V, 3 V
Width
8 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Revision H (October 2010)
This revision includes the following updates:
• Text and formatting updates have been
• All references to V
• All occurrences of PGC and PGD have been
• Added topics covered in
• Moved the Checksum Computation table to the
• Updated all occurrences of TBLPG to TBLPAG
• Removed the ERASEB command from the
• Updated the High-Level Enhanced ICSP™
• Replaced the Device Configuration Register Map
• Updated the Note in
• Changed Opcode 0x7 to Reserved in the
• Removed 4.2.10 “ERASEB Command”
• Updated the table cross-references in
• Combined all Default Configuration Register
• Relocated the paragraph on ICSP programming
• Added a Note to
• Updated Step 4 in Programming the Programming
• Updated Device IDs and Revision IDs (see
• Updated parameters D111, P1, P1A and P1B in
• Added Checksum Computation Example When
DS70152H-page 82
incorporated throughout the document
changed to: V
changed to PGCx and PGDx, respectively
Overview”
appendix (see
throughout the document
Command Set Summary (see
Programming Flow (see
(previously Table 4-3) with individual tables for
each dsPIC33F/PIC24H device family (see
Table 3-3
“Programming Methodology”
Programming Executive Command Set (see
Table
Section 5.7 “Writing Configuration Memory”
Values tables into one table (see
details, which now appears just before
Executive (see
Table
the AC/DC Characteristics and Timing
Requirements (see
Using CodeGuard™ Security (see
4-1)
7-1)
through
CAP
Table
Table
Section 6.1 “Overview”
Table
CAP
Table
Section 3.6.2
D-1)
6-1)
/V
DDCORE
3-12)
Figure
Section 1.0 “Device
8-1)
Table
3-1)
have been
Table
Table
3-1)
Table 5-7
5-6)
D-2).
© 2010 Microchip Technology Inc.