PIC16F74-I/P Microchip Technology, PIC16F74-I/P Datasheet - Page 6

• Manufacturer Part Number: PIC16F74-I/P
• Description: IC MCU FLASH 4KX14 A/D 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F74-I/P

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 33
• Program Memory Type: FLASH
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 33
• Ram Memory Size: 192Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 33
• Interface Type: I2C/SPI/USART
• On-chip Adc: 8-chx8-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 192 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 444-1001 - DEMO BOARD FOR PICMICRO MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC16F73/74/76/77
4. Module: Packaging (Pinout and Product
FIGURE 2:
DS80099G-page 6
PIC16F74 and PIC16F77 devices are now offered
in a 44-pin, micro lead frame package (commonly
known as “QFN”). This provides near chip scale
package size. This option is in addition to the 28-pin
QFN packages already available for the PIC16F73
and PIC16F76 devices. The 44-pin QFN package
has been added to the product line since the
original publication of the Device Data Sheet.
The addition of this option requires the following
additions to the Device Data Sheet (DS30325B).
Referenced figures and tables follow this text.
1. The “Pin Diagrams” on pages 2-3 of the Data
2. Table 1.3 of Section 1.0 (“Device Overview”) is
Sheet are amended with the addition of the
44-pin QFN pinout shown in Figure 2.
replaced with an updated version which adds a
column for QFN pin assignments. All new
information is indicated in bold.
44-Pin QFN
Identification)
PINOUT DIAGRAM FOR PIC16F74/77, 44-PIN QFN PACKAGE
RC7/RX/DT
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
RB0/INT0
RB1
RB2
V
V
V
DD
DD
SS
1
2
3
4
5
6
7
8
9
10
11
PIC16F74
PIC16F77
3. Section 17.1 (“Package Marking Information”)
4. Section 17.2 (“Package Details”) is amended
5. In the
33
32
31
30
29
28
27
26
25
24
23
is amended to include a marking template and
example for 44-pin QFN devices. These are
shown in Figure 3.
to include the mechanical drawing of the 44-pin
QFN package, following the existing drawings.
This is shown in Figure 4.
System” (page 171), the “ML” line item in the
“Package” options section should now read
(change in bold):
ML =
For the sake of completeness, it is also noted
that the package designation “MLF” is now
replaced by “QFN” in all occurrences through-
out the Device Data Sheet. “MLF” should be
considered an obsoleted term.
OSC2/CLKO
OSC1/CLKI
V
V
V
V
RE2/AN7/CS
RE1/AN6/WR
RE0/AN5/RD
RA5/AN4/SS
RA4/T0CKI
QFN
SS
SS
DD
DD
“PIC16F7X
 2003 Microchip Technology Inc.
Product Identification