PIC24HJ128GP202-I/SP Microchip Technology, PIC24HJ128GP202-I/SP Datasheet - Page 17
![IC PIC MCU FLASH 128K 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC24HJ128GP202-I/SP
Manufacturer Part Number
PIC24HJ128GP202-I/SP
Description
IC PIC MCU FLASH 128K 28DIP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP302-ISO.pdf
(368 pages)
3.PIC24HJ32GP302-ISO.pdf
(8 pages)
4.PIC24HJ32GP302-ISO.pdf
(12 pages)
5.PIC24HJ32GP304-EML.pdf
(356 pages)
Specifications of PIC24HJ128GP202-I/SP
Program Memory Type
FLASH
Program Memory Size
128KB (43K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit or 10-ch x 12-bit
Controller Family/series
PIC24
No. Of I/o's
21
Ram Memory Size
8KB
Cpu Speed
40MIPS
No. Of Timers
7
Embedded Interface Type
I2C, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164337 - MODULE SOCKET FOR PM3 40DIP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP302-ISO PDF datasheet #2
- PIC24HJ32GP302-ISO PDF datasheet #3
- PIC24HJ32GP302-ISO PDF datasheet #4
- PIC24HJ32GP304-EML PDF datasheet #5
- Current page: 17 of 368
- Download datasheet (5Mb)
2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging
purposes. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will
communications to the device. If such discrete
components are an application requirement, they
should
programming and debugging. Alternatively, refer to the
AC/DC
information
programming
capacitive loading limits and pin input voltage high (V
and input low (V
Ensure that the “Communication Channel Select”
(i.e., PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
ICE™.
For more information on ICD 2, ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip website.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
© 2011 Microchip Technology Inc.
Guide” DS51331
Guide” DS51616
interfere
®
ICSP Pins
be
characteristics
ICD 2, MPLAB
®
®
®
®
PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
ICD 2 In-Circuit Debugger User’s
ICD 2 Design Advisory” DS51566
ICD 3 Design Advisory” DS51764
REAL ICE™ In-Circuit Emulator User’s
in
removed
IL
specification
®
®
®
) requirements.
with
ICD 2” (poster) DS51265
ICD 3” (poster) DS51765
REAL ICE™” (poster) DS51749
the
the
respective
®
from
and
ICD 3 or MPLAB
programmer/debugger
for
timing
the
information
device
circuit
requirements
®
during
REAL
Flash
IH
on
)
2.6
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to
Configuration”
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in
FIGURE 2-3:
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
External Oscillator Pins
for details).
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Figure
Section 9.0 “Oscillator
DS70293E-page 17
2-3.
13
14
15
16
17
18
19
20
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