DSPIC33FJ128GP202-I/SP Microchip Technology, DSPIC33FJ128GP202-I/SP Datasheet - Page 393

• Manufacturer Part Number: DSPIC33FJ128GP202-I/SP
• Description: IC DSPIC MCU/DSP 128K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP202-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Package: 28SPDIP
• Device Core: dsPIC
• Family Name: dsPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Interface Type: I2C/SPI/UART
• On-chip Adc: 10-chx10-bit|10-chx12-bit
• On-chip Dac: 2-chx16-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MA330019 - PIM DSPIC33F MC 44P-100P QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

INDEX
A
A/D Converter ................................................................... 253
AC Characteristics .................................................... 332, 372
ADC Module
Alternate Interrupt Vector Table (AIVT) .............................. 87
Arithmetic Logic Unit (ALU)................................................. 32
Assembler
B
Barrel Shifter ....................................................................... 36
Bit-Reversed Addressing .................................................... 66
Block Diagrams
C
C Compilers
Clock Switching................................................................. 151
Code Examples
Code Protection ........................................................ 301, 307
Comparator Module .......................................................... 265
Configuration Bits.............................................................. 301
Configuration Register Map .............................................. 301
Configuring Analog Port Pins ............................................ 160
 2009 Microchip Technology Inc.
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
DMA .......................................................................... 253
Initialization ............................................................... 253
Key Features............................................................. 253
ADC Module.............................................................. 375
ADC Module (10-bit Mode) ....................................... 376
ADC Module (12-bit Mode) ....................................... 375
Internal RC Accuracy ................................................ 334
Load Conditions ................................................ 332, 372
ADC11 Register Map .................................................. 51
MPASM Assembler................................................... 320
Example ...................................................................... 67
Implementation ........................................................... 66
Sequence Table (16-Entry)......................................... 67
16-bit Timer1 Module ................................................ 187
A/D Module ....................................................... 254, 255
Connections for On-Chip Voltage Regulator............. 305
DCI Module ............................................................... 247
Device Clock ..................................................... 141, 143
DSP Engine ................................................................ 33
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04,
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04,
ECAN Module ........................................................... 222
Input Capture ............................................................ 195
Output Compare ....................................................... 197
PLL............................................................................ 143
Reset System.............................................................. 79
Shared Port Structure ............................................... 159
SPI ............................................................................ 201
Timer2 (16-bit) .......................................................... 189
Timer2/3 (32-bit) ....................................................... 191
UART ........................................................................ 215
Watchdog Timer (WDT) ............................................ 306
Hi-Tech C.................................................................. 320
MPLAB C .................................................................. 320
Enabling .................................................................... 151
Sequence.................................................................. 151
Erasing a Program Memory Page............................... 77
Initiating a Programming Sequence............................ 78
Loading Write Buffers ................................................. 78
Port Write/Read ........................................................ 160
PWRSAV Instruction Syntax..................................... 153
and dsPIC33FJ128GPX02/X04 ......................... 16
and dsPIC33FJ128GPX02/X04 CPU Core........ 26
Preliminary
CPU
CPU Clocking System ...................................................... 142
Customer Change Notification Service............................. 401
Customer Notification Service .......................................... 401
Customer Support............................................................. 401
D
Data Accumulators and Adder/Subtracter .......................... 34
Data Address Space........................................................... 39
Data Converter Interface (DCI) Module ............................ 247
DC Characteristics............................................................ 324
DCI
DCI Module
Demonstration/Development Boards, Evaluation Kits,
Development Support ....................................................... 319
DMA Module
DMAC Registers ............................................................... 131
Doze Mode ....................................................................... 154
DSP Engine ........................................................................ 32
Control Register.......................................................... 28
PLL Configuration..................................................... 143
Selection................................................................... 142
Sources .................................................................... 142
Data Space Write Saturation ...................................... 36
Overflow and Saturation ............................................. 34
Round Logic ............................................................... 35
Write Back .................................................................. 35
Alignment.................................................................... 39
Memory Map for dsPIC33FJ128GP202/204 and
Memory Map for dsPIC33FJ128GP802/804 and
Memory Map for dsPIC33FJ32GP302/304
Near Data Space ........................................................ 39
Software Stack ........................................................... 63
Width .......................................................................... 39
Doze Current (I
High Temperature..................................................... 370
I/O Pin Input Specifications ...................................... 329
I/O Pin Output........................................................... 371
I/O Pin Output Specifications.................................... 330
Idle Current (I
Idle Current (I
Operating Current (I
Operating MIPS vs. Voltage ..................................... 370
Power-Down Current (I
Power-down Current (I
Program Memory.............................................. 331, 371
Temperature and Voltage......................................... 370
Temperature and Voltage Specifications.................. 325
Thermal Operating Conditions.................................. 370
Introduction............................................................... 247
Register Map .............................................................. 56
and Starter Kits......................................................... 322
DMA Register Map ..................................................... 52
DMAxCNT ................................................................ 131
DMAxCON................................................................ 131
DMAxPAD ................................................................ 131
DMAxREQ ................................................................ 131
DMAxSTA ................................................................. 131
DMAxSTB ................................................................. 131
Multiplier ..................................................................... 34
with 8 KB RAM ................................................... 41
with 16 KB RAM ................................................. 42
Devices with 4 KB RAM...................................... 40
dsPIC33FJ64GP202/204 Devices
dsPIC33FJ64GP802/804 Devices
DOZE
IDLE
DOZE
) .................................................... 327
) .................................................. 328
DD
)................................................ 371
) ............................................ 326
PD
PD
) ........................................ 370
)........................................ 328
DS70292D-page 393