PIC24HJ128GP306-I/PT Microchip Technology, PIC24HJ128GP306-I/PT Datasheet - Page 276
![IC PIC MCU FLASH 64KX16 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
PIC24HJ128GP306-I/PT
Manufacturer Part Number
PIC24HJ128GP306-I/PT
Description
IC PIC MCU FLASH 64KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ64GP206-IPT.pdf
(292 pages)
3.PIC24HJ64GP206-IPT.pdf
(8 pages)
4.PIC24HJ64GP206-IPT.pdf
(20 pages)
5.PIC24HJ64GP206-IPT.pdf
(26 pages)
6.PIC24HJ128GP306-IPT.pdf
(288 pages)
Specifications of PIC24HJ128GP306-I/PT
Core Size
16-Bit
Program Memory Size
128KB (43K x 24)
Core Processor
PIC
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC24
No. Of I/o's
53
Ram Memory Size
16KB
Cpu Speed
40MIPS
No. Of Timers
13
No. Of Pwm Channels
8
Embedded Interface Type
I2C, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ128GP306-I/PT
Manufacturer:
MICROCHIP
Quantity:
455
Company:
Part Number:
PIC24HJ128GP306-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ64GP206-IPT PDF datasheet #2
- PIC24HJ64GP206-IPT PDF datasheet #3
- PIC24HJ64GP206-IPT PDF datasheet #4
- PIC24HJ64GP206-IPT PDF datasheet #5
- PIC24HJ128GP306-IPT PDF datasheet #6
- Current page: 276 of 292
- Download datasheet (5Mb)
PIC24HJXXXGPX06/X08/X10
DS70175H-page 274
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
e
b
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
NOTE 2
E1
φ
L
Units
A2
A1
E1
D1
L1
N
A
E
D
e
L
φ
b
α
β
c
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
© 2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
A2
α
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