DSPIC33FJ128GP802-I/MM Microchip Technology, DSPIC33FJ128GP802-I/MM Datasheet - Page 153

• Manufacturer Part Number: DSPIC33FJ128GP802-I/MM
• Description: IC DSPIC MCU/DSP 128K 28QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP802-I/MM

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 28-QFN
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b, D/A 4x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 16 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

10.0
The dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/
X04, and dsPIC33FJ128GPX02/X04 devices provide
the ability to manage power consumption by selectively
managing clocking to the CPU and the peripherals. In
general, a lower clock frequency and a reduction in the
number of circuits being clocked constitutes lower
consumed
dsPIC33FJ64GPX02/X04, and dsPIC33FJ128GPX02/
X04 devices can manage power consumption in four
ways:
• Clock frequency
• Instruction-based Sleep and Idle modes
• Software-controlled Doze mode
• Selective peripheral control in software
Combinations of these methods can be used to selec-
tively tailor an application’s power consumption while
still maintaining critical application features, such as
timing-sensitive communications.
10.1
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04,
and dsPIC33FJ128GPX02/X04 devices allow a wide
range of clock frequencies to be selected under
application control. If the system clock configuration is
not locked, users can choose low-power or high-
precision oscillators by simply changing the NOSC bits
(OSCCON<10:8>). The process of changing a system
clock during operation, as well as limitations to the
process, are discussed in more detail in
“Oscillator
EXAMPLE 10-1:
© 2011 Microchip Technology Inc.
PWRSAV #SLEEP_MODE
PWRSAV #IDLE_MODE
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
Note 1: This data sheet summarizes the features
2: Some registers and associated bits
POWER-SAVING FEATURES
Clock Frequency and Clock
Switching
Configuration”.
of
dsPIC33FJ64GPX02/X04,
dsPIC33FJ128GPX02/X04 families of
devices. It is not intended to be a compre-
hensive reference source. To comple-
ment the information in this data sheet,
refer to “Section 9. Watchdog Timer
and Power-Saving Modes” (DS70196)
of the “dsPIC33F/PIC24H Family Refer-
ence Manual”, which is available from the
Microchip website (www.microchip.com).
described in this section may not be avail-
able on all devices. Refer to
“Memory Organization”
sheet for device-specific register and bit
information.
power.
the
PWRSAV INSTRUCTION SYNTAX
dsPIC33FJ32GP302/304,
dsPIC33FJ32GP302/304,
; Put the device into SLEEP mode
; Put the device into IDLE mode
in this data
Section 4.0
Section 9.0
and
10.2
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04,
and dsPIC33FJ128GPX02/X04 devices have two
special power-saving modes that are entered through
the execution of a special PWRSAV instruction. Sleep
mode stops clock operation and halts all code
execution. Idle mode halts the CPU and code
execution, but allows peripheral modules to continue
operation. The assembler syntax of the PWRSAV
instruction is shown in
Sleep and Idle modes can be exited as a result of an
enabled interrupt, WDT time-out or a device Reset. When
the device exits these modes, it is said to wake up.
10.2.1
The following occur in Sleep mode:
• The system clock source is shut down. If an
• The device current consumption is reduced to a
• The Fail-Safe Clock Monitor does not operate,
• The LPRC clock continues to run in Sleep mode if
• The WDT, if enabled, is automatically cleared
• Some device features or peripherals can continue
• Any peripheral that requires the system clock
The device wakes up from Sleep mode on any of these
events:
• Any interrupt source that is individually enabled
• Any form of device Reset
• A WDT time-out
On wake-up from Sleep mode, the processor restarts
with the same clock source that was active when Sleep
mode was entered.
on-chip oscillator is used, it is turned off.
minimum, provided that no I/O pin is sourcing
current.
since the system clock source is disabled.
the WDT is enabled.
prior to entering Sleep mode.
to operate. This includes items such as the input
change notification on the I/O ports, or peripherals
that use an external clock input.
source for its operation is disabled.
Note:
Instruction-Based Power-Saving
Modes
SLEEP MODE
SLEEP_MODE and IDLE_MODE are con-
stants defined in the assembler include
file for the selected device.
Example
10-1.
DS70292E-page 153