PIC16F876-20/SP Microchip Technology, PIC16F876-20/SP Datasheet - Page 73
PIC16F876-20/SP
Manufacturer Part Number
PIC16F876-20/SP
Description
IC MCU FLASH 8KX14 EE 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873-04SO.pdf
(218 pages)
5.PIC16F873-04SO.pdf
(5 pages)
6.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F876-20/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/PSP/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
5-ch x 10-bit
Data Rom Size
256 B
A/d Bit Size
10 bit
A/d Channels Available
5
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F876-20/SP
Manufacturer:
MICROCHIP
Quantity:
6 264
Part Number:
PIC16F876-20/SP
Manufacturer:
MIC
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16C770-ISO PDF datasheet #3
- PIC16F873-04SO PDF datasheet #4
- PIC16F873-04SO PDF datasheet #5
- PIC16F873-04SO PDF datasheet #6
- Current page: 73 of 688
- Download datasheet (3Mb)
4.2
1997 Microchip Technology Inc.
OSC2/CLKOUT
(RC mode)
Clocking Scheme/Instruction Cycle
OSC1
Q4
PC
Q2
Q3
Q1
The clock input (from OSC1) is internally divided by four to generate four non-overlapping
quadrature clocks, namely Q1, Q2, Q3, and Q4. Internally, the program counter (PC) is incre-
mented every Q1, and the instruction is fetched from the program memory and latched into the
instruction register in Q4. The instruction is decoded and executed during the following Q1
through Q4. The clocks and instruction execution flow are illustrated in
Example
Figure 4-3: Clock/Instruction Cycle
Q1
Execute INST (PC-1)
Fetch INST (PC)
Q2
T
4-1.
CY
PC
1
Q3
Q4
Q1
Execute INST (PC)
Fetch INST (PC+1)
Section 4. Architecture
Q2
T
PC+1
CY
2
Q3
Q4
Q1
Execute INST (PC+1)
Fetch INST (PC+2)
Q2
T
PC+2
CY
3
Q3
Q4
DS31004A-page 4-5
Figure
Internal
phase
clock
4-3, and
4
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