PIC24HJ128GP510-I/PT Microchip Technology, PIC24HJ128GP510-I/PT Datasheet - Page 5
![IC PIC MCU FLASH 64KX16 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
PIC24HJ128GP510-I/PT
Manufacturer Part Number
PIC24HJ128GP510-I/PT
Description
IC PIC MCU FLASH 64KX16 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ64GP206-IPT.pdf
(292 pages)
3.PIC24HJ64GP206-IPT.pdf
(8 pages)
4.PIC24HJ64GP206-IPT.pdf
(20 pages)
5.PIC24HJ64GP206-IPT.pdf
(26 pages)
Specifications of PIC24HJ128GP510-I/PT
Core Size
16-Bit
Program Memory Size
128KB (43K x 24)
Core Processor
PIC
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFQFP
Controller Family/series
PIC24
No. Of I/o's
85
Ram Memory Size
9Byte
Cpu Speed
40MHz
No. Of Timers
9
No. Of Pwm Channels
8
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
CAN, I2C, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Number Of Timers
13
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 32 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDAC164333 - MODULE SKT FOR PM3 100QFPDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ128GP510-I/PT
Manufacturer:
MICROCHIP
Quantity:
260
Company:
Part Number:
PIC24HJ128GP510-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC24HJ128GP510-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
12. Module: DMA Module: Interaction with
13. Module: DISI Instruction
© 2006 Microchip Technology Inc.
The EXCH instruction does not execute correctly
when either of the two operands is numerically
equal to the address of any of the DMAC SFRs for
this revision of silicon.
Work around
If writing source code in assembly, the
recommended fix is to replace:
with:
If using the MPLAB C30 C compiler, check the dis-
assembly listing (View>Disassembly Listing) for
the EXCH instruction. If used, make sure the oper-
ands are not equivalent to the DMA SFRs’
addresses.
When a user executes a DISI #7, for example,
this will disable interrupts for 7 + 1 cycles (7 + the
DISI instruction itself). In this case, the DISI
instruction uses a counter which counts down from
7 to 0. The counter is loaded with 7 at the end of
the DISI instruction.
If the user code executes another DISI on the
instruction cycle where the DISI counter has
become zero, the new DISI count is loaded, but
the DISI state machine does not properly re-
engage and continue to disable interrupts. At this
point, all interrupts are enabled. The next time the
user code executes a DISI instruction, the feature
will act normally and block interrupts.
In summary, it is only when a DISI execution is
coincident with the current DISI count = 0, that the
issue occurs. Executing a DISI instruction before
the DISI counter reaches zero will not produce
this error. In this case, the DISI counter is loaded
with the new value, and interrupts remain disabled
until the counter becomes zero.
Work around
When executing multiple DISI instructions within
the source code, make sure that subsequent DISI
instructions have at least one instruction cycle
between the time that the DISI counter decre-
ments to zero and the next DISI instruction. Alter-
natively, make sure that subsequent DISI
instructions are called before the DISI counter
decrements to zero.
EXCH Wsource, Wdestination
PUSH Wdestination
MOV Wsource, Wdestination
POP Wsource
EXCH Instruction
PIC24H ENGINEERING SAMPLES
14. Module: JTAG Programming
15. Module: Internal FRC Oscillator
16. Module: ECAN Loopback Mode
17. Module: Oscillator Configuration Block
18. Module: I
JTAG programming does not work in silicon
revision A0/A1.
Work around
None.
The internal FRC oscillator is not calibrated on
silicon revision A0/A1.
Work around
The user can calibrate the internal oscillator man-
ually by modifying the OSCTUN bits. This is done
by using a waveform generator or other external
source to generate a square wave of known fre-
quency on one of the input capture pins. Configure
the corresponding Input Capture module to mea-
sure the square wave period. Calculate the value
that the input capture module should generate
based on a nominal internal FRC oscillator fre-
quency of 7.37 MHz. Adjust the OSCTUN bits until
the measured input capture value matches the
calculated value.
The ECAN module (ECAN1 or ECAN2) does not
function correctly in Loopback mode.
Work around
Do not use Loopback mode.
If the fail-safe clock monitoring function is enabled,
during a failure of the external oscillator, the device
will automatically switch to the internal FRC oscil-
lator. A clock failure trap event is also generated.
In revision A0/A1 parts, once this interrupt occurs,
the clock source cannot be switched from the
internal FRC oscillator.
Work around
The user must issue a Reset before attempting to
change clock sources after a clock fail event.
The I
when it detects bus activity.
Work around
None.
2
C module does not wake-up from Sleep
2
C
DS80260B-page 5